Sodium borohydride reduction of aqueous silver-iron-nickel solutions: A chemical route to synthesis of low thermal expansion - High conductivity ag-invar alloys

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 40, Issue 7, 2009, Pages 1701-1709

  Sterling, E A ^a   Stolk, J ^a   Hafford, L ^a   Gross, M ^b  

^a FRANKLIN W OLIN COLLEGE OF ENGINEERING   (United States)

^b BUCKNELL UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ROUTES; CHEMICAL SYNTHESIS; COEFFICIENTS OF THERMAL EXPANSIONS; ELECTRICAL CONDUCTIVITY MEASUREMENTS; ELECTRONICS SYSTEM; HEAT EXTRACTION; HIGH CONDUCTIVITY; HIGH ELECTRICAL CONDUCTIVITY; INTERFACIAL SHEAR; INVAR ALLOY; IRON-NICKEL; LOW THERMAL EXPANSION; NI METAL; NI POWDER; POWDER PROCESSING; SODIUM BOROHYDRIDE; SYSTEM FAILURES; THERMAL MANAGEMENT; THERMAL MANAGEMENT APPLICATIONS; THERMAL MISMATCH; THERMO-MECHANICAL ANALYSIS; WIEDEMANN-FRANZ LAW;

CERIUM ALLOYS; DISSIMILAR MATERIALS; ELASTICITY; ELECTRIC CONDUCTIVITY; ELECTRIC NETWORK ANALYSIS; IRON ALLOYS; METAL RECOVERY; NANOCRYSTALLINE ALLOYS; NICKEL; PACKAGING MATERIALS; POWDER METALS; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SINTERING; SODIUM ALLOYS; STRUCTURAL DESIGN; SYNTHESIS (CHEMICAL); SYSTEMS ENGINEERING; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL STRESS; THERMOANALYSIS; THERMODYNAMIC STABILITY; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

THERMAL EXPANSION;

EID: 67650443964     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-009-9859-4     Document Type: Article

References (26)

1. F.J. Dance and J.L. Wallace: Circuit World, 1982, vol. 9, pp. 4-7.
2. H. Baudry and G. Kersuzan: 5th Euro. Hybrid Microelectronics Conf. Proc., 1985, pp. 454-64.
3. W.R. Johannes and W. Johnson: Int. J. Microcircuits Elec. Pkg., 1994, vol. 17, pp. 135-42.
4. D.S. Copeland, M.K. Rahim, J.C. Suhling, G. Tian, P. Lall, and R.C. Jaeger: Proc. 2005 ASME Int. Mech. Engr. Congress Expo., 2005, pp. 185-98.
5. R.A. Koch, R. Watts, T. Benson-Tolle, and K. Strong: Proc. 48th Int. SAMPE Symp., 2003, pp. 84-89.
6. V. Sundaram, R. Tummala, B. Wiedenman, F. Liu, P.M. Raj, I.R. Abothu, S. Bhattacharya, M. Varadarajan, E. Bongio, and W. Sherwood: Proc. 56th Elec. Comp. Tech. Conf., 2006, pp. 1357-80.
7. C. Zweben: J. Adv. Mater., 2007, vol. 39 (1), pp. 3-10.
8. A. Luedtke: Adv. Eng. Mater., 2004, vol. 6 (3), pp. 142-44.
9. F. Spexarth: J. Cronin, and W. Johnson: Int. J. Microcircuits Elec. Pkg., 1995, vol. 18 (2), pp. 138-45.
10. F. Spexarth, J. Cronin, and W. Johnson: Adv. Pkg., 1995, Mar.-Apr., pp. 36-38.
11. P. Yih and D.D.L. Chung: J. Mater. Sci., 1997, vol. 32 (11), pp. 2873-82.
12. S. Jha: Proc. 45th Elec. Component Technol. Conf., 1995, pp. 542-47.
13. D.E. Jech and J.L. Sepulveda: Int. Symp. Microelectron., SPIE Proc. 3235, 1997, pp. 90-96.
14. J. Stolk and A. Manthiram: Metall. Mater. Trans. A, 2000, vol. 31A, pp. 2396-98.
15. R.M. Bozorth: Ferromagnetism, Van Nostrand, Princeton, NJ, 1978, p. 641.
16. D.F. Berry: ASM Handbooks Online, ASM INTERNATIONAL, Materials Park, OH, 2002, vol. 2.
17. E.L. Frantz: ASM Handbooks Online, ASM INTERNATIONAL, Materials Park, OH, 2002, vol. 2.
18. W. Johnson and S. Nelson: Proc. IEPS Conf., 1995, pp. 228-35.
19. J. Stolk, M. Gross, D. Stolk, and A. Manthiram: J. Mater. Res., 2001, vol. 16 (2), pp. 340-43.
20. L.J. van der Pauw: Philips Technol. Rev., 1958, vol. 20, pp. 220-24.
21. F.J. Blatt: Physics of Electronic Conduction in Solids, McGraw-Hill Book Company, New York, NY, 1968.
22. A.A. Fahmy and A.N. Ragai: J. Appl. Phys., 1970, vol. 41, pp. 5108-11.
23. ASM Handbooks Online, ASM INTERNATIONAL, Materials Park, OH, 2002, vol. 3.
24. ASTM B 742-90(2006), ASTM, Philadelphia, PA, 2006.
25. ASTM F 1684-06, ASTM, Philadelphia, PA, 2006.
26. D.R. Poirier and G.H. Geiger: Transport Phenomena in Materials Processing, TMS, Warrendale, PA, 1998, pp. 208-11.