Technology advancements for flipchip microprocessor lid adhesive

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 1028-1034

  Dent, Stanton J ^a   Diep, Jacquana ^b   Hale, Cassandra ^a   Larson, Lyndon ^a   Too, Seah S ^b   Zhai, Charlie ^b  

^a DOW CORNING CORPORATION   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

Adhesive; Flip chip; Heat Spreader; Lid; Silicone

Indexed keywords

FLIP CHIP; HEAT SPREADERS; INTEGRATED APPROACH; LID; MICROPROCESSOR APPLICATIONS; PACKAGING ENGINEERS; PERFORMANCE REQUIREMENTS; TECHNOLOGY ADVANCEMENT;

ADHESIVES; ASSEMBLY; COMMERCE; ENERGY MANAGEMENT; FLIP CHIP DEVICES; LAPTOP COMPUTERS; MICROELECTRONICS; MICROPROCESSOR CHIPS; RELIABILITY; SILICONES; STRESSES; SUBSTRATES;

CHIP SCALE PACKAGES;

EID: 84876928762     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. th ECTC, 2007
2. Seah Too, Raj Master et.al., "Effect of organic package warpage on microprocessor thermal performance, pp.748, 57th ECTC, 2007
3. Clarson, Stephen J and Mark, James E in Siloxane Polymers, S.J Clarson and J.A. Semlyn, (eds.), Chapter 13, pp. 616-624, Prentice Hall, Englewood Cliffs, NJ, 1993