Synthesis and performance of colloidal silica Nano-Abrasives with controllable size for chemical mechanical planarization

Journal of Nanoscience and Nanotechnology

Volumn 9, Issue 2, 2009, Pages 1054-1057

  Zhang, K L ^a,b   Song, Z T ^b   Wang, F ^a   Wang, L Y ^b   Feng, S L ^b  

^a TIANJIN UNIVERSITY OF TECHNOLOGY   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

CMP slurry; Colloidal silica nano abrasive; Controllable size

Indexed keywords

CHEMICAL-MECHANICAL PLANARIZATION; CMP SLURRY; COLLOIDAL SILICA; COLLOIDAL SILICA NANO-ABRASIVE; CONTROLLABLE SIZE; MONODISPERSE; PARTICLE GROWTH; POLISHING RATE; POLYMERIZATION PROCESS; SEM; ZETA POTENTIAL ANALYZERS;

ABRASIVES; CHEMICAL MECHANICAL POLISHING; ION EXCHANGE; PHOTORESISTS; SILICA; SLURRIES; SURFACE ROUGHNESS; SYNTHESIS (CHEMICAL); ZETA POTENTIAL;

NANOTECHNOLOGY;

EID: 67649246369     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2009.C086     Document Type: Conference Paper

References (9)

1. P. B. Zantye, A. Kumar, and A. K. Sikder, Materials Science and Engineering: R: Reports 45, 89 (2004).
2. X. D. Feng, D. C. Sayle, Z. L. Wang, M. S1. Paras, B. Santora, A. C. Sutorik, T. X. T. Sayle, Y. Yang, Y. Ding, X. D. Wang, and Y. S. Her, Science 312, 1504 (2006).
3. K. Cheemalapati, A. Chowdhury, V. Duvvuru, Y. Lin, K. Tang, G. Bian, L. Yao, and Y. Z. Li, Mat. Res. Soc. Syinp. Proc. 816, Kl.7.l (2004).
4. S. H. Lee, Z. Y. Lu, S. V. Babu, and E. Matijevic, J. Mater Res. 17, 2744 (2002).
5. K. L. Zhang, Study on Preparation and Application of Nanometer Abrasive for Chemical Mechanical Polishing in ULSI, Dissertation of doctor from Hebei University of Technology, Tianjin (2004).
6. A. B. Dai, Sd. China Ser 12 1311(1963).
7. P. P. von Weimarn, Chem. Rev. 2, 217 (1925).
8. W. L. Albrecht and N. Ill, US3673104 (1972).
9. K. L. Zhang, Z. T. Song, C. L. Lin, S.L. Feng, and B. Chen, Journal of Ceramic Processing Research 8, 52 (2007).