Combinatorial Approach for Thermoelectric Materials through Bulk Composition-Spreads and Diffusion Multiples

Materials Research Society Symposium Proceedings

Volumn 1024, Issue , 2008, Pages 24-29

  Yamamoto, Atsushi ^a   Noguchi, Teruo ^a   Obara, Haruhiko ^a   Ueno, Kazuo ^a   Dceuchi, Satoaki ^b   Sugawara, Tooru ^b   Shimada, Kenji ^b   Takasaki, Youichi ^b   Ishii, Yoshikazu ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b Ulvac Riko Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BULK COMPOSITIONS; BULK DIFFUSIONS; COMBINATORIAL APPROACH; COMPOSITION VARIATION; CROSS SECTION; DIFFUSION LENGTH; GRADED COMPOSITION; HIGH-THROUGHPUT SCREENING; MICROANALYZER; MOLTEN METAL; PIXEL IMAGES; REGION OF INTEREST; ROOM TEMPERATURE; SAMPLE PREPARATION; SCREENING EXPERIMENTS; SPARK PLASMA SINTERING PROCESS; THERMAL PROBE; THERMOELECTRIC MATERIAL; THERMOELECTRIC PROPERTIES; TWO DIMENSIONAL DISTRIBUTION;

DIFFUSION; HEATING; IMAGE SEGMENTATION; LIQUID METALS; MECHANICAL ALLOYING; METALLURGY; NICKEL; SPARK PLASMA SINTERING; TELLURIUM COMPOUNDS; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY; THROUGHPUT; TIN;

MATERIALS SCIENCE;

EID: 67649235107     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

1. B.C.Sales, D. Mandrus,R.K.Williams, Science, 272, (1996) p. 1325.
2. I.Terasaki, Y.Sasago, K.Uchinokura, Phys.Rev. B, 56 (1997) R12685.
3. R.Funahashi, I. Matsubara, H. Dcuta, T. Takeuchi, U. Mizutani, S. Sodeoka, Jpn. J. Appl. Phys. 2, Lett, 39 (2000) LI 127.
4. S. Sakurada and N. Shutoh, Appl. Phys. Lett. 86, 082105(2005).
5. R Funahashi, M Mikami, S Urata, M Kitawaki, T Kouuchi and K Mizuno, Meas. Sci. Technol. 16(2005)pp.70-80.
6. Jap. J. Appl. Phys., Vol. 44, No. 8, 2005, pp. 6164-6166.
7. A. Yamamoto, Proc. MRS Proceedings No.804 (2004) pp.3-14.
8. K. Itaka, Q.J. Wang, H. Minami, H. Kawaji, H. Koinuma Applied Surface Science, 223 (2004) pp. 20-23.
9. G.Binnig, H.Rohrer, Ch.Gerber nad E.Weibel, Phys. Rev. Lett. 49, 57 (1982).
10. C.C.Williams and H.K.Wickramasinghe, Appl. Phys. Lett. 49, 1587(1986).
11. M.Nonnenmacher and H.K.Wickramasinghe, Appl. Phys. Lett. 61, 168(1992).
12. C.C.Williams and H.K.Wickramasinghe, Nature. 344, 3177(1990).
13. H.SiiBmann, M.Bohm, P.Reinshaus, Proc.l2'h Int. Conf. on Thermoelectrics, Yokohama 86(1993).
14. L.D.Ivanova, H.SuBmann, P. Reinhaus, Th.Dietrich, Proc. 14th Int. Conf. on Thermoelectrics, St. Petersburg (1995) p. 13.
15. A.Yamamoto and T.Ohta, Mater. Res. Soc. Proc. 478, Pittsburgh, PA, (1997) p. 115.
16. A.Yamamoto, C.H.Lee, H.Takazawa, T.Ohta, K.Ueno, T.Aizawa and H.Fukagawa, Proc. FGM2000, (2001) p. 119.
17. A.Yamamoto, H.Takazawa, C.H.Lee, and T.Ohta, Proc. FGM2001, (2002) p.7.