Interactions between silica nanoparticles and an epoxy resin before and during network formation

Polymer

Volumn 50, Issue 14, 2009, Pages 3211-3219

  Baller, Jörg ^a   Becker, Nora ^a   Ziehmer, Markus ^a   Thomassey, Matthieu ^a   Zielinski, Bartosz ^a   Müller, Ulrich ^a   Sanctuary, Roland ^a  

^a UNIVERSITY OF LUXEMBOURG   (Luxembourg)

Author keywords

Epoxy; Nanocomposite; Thermoset

Indexed keywords

CHEMICAL BONDS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; FILLED POLYMERS; MOLECULES; NANOCOMPOSITES; POLYMER MATRIX COMPOSITES; SILICA NANOPARTICLES; SPECIFIC HEAT; THERMOSETS;

CHEMICAL BONDINGS; CURING TEMPERATURE; DIGLYCIDYL ETHER OF BISPHENOL-A; EPOXY; MACROSCOPIC PROPERTIES; MOLECULAR MOBILITY; POLYMER NANOCOMPOSITE; TEMPERATURE MODULATED DIFFERENTIAL SCANNING CALORIMETRY;

EPOXY RESINS;

CURING (CHEMISTRY); EPOXY RESIN; NANOCOMPOSITE; OLIGOMER; POLYMER PROPERTY; RHEOLOGY; SILICON DIOXIDE; TEMPERATURE EFFECT;

EID: 67649119706     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2009.05.020     Document Type: Article

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