Silicon nanostructuring for 3D bulk silicon versatile devices

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 885-888

  Bopp, M ^a   Coronel, P ^b   Bustos, J ^c   Pribat, C ^c   Dainesi, P ^a   Skotnicki, T ^c   Ionescu, A M ^a  

^a EPFL   (Switzerland)

^b CEA GRENOBLE   (France)

^c STMICROELECTRONICS   (France)

Author keywords

3D nanostructure design; Hard mask; Hydrogen annealing; Silicon reflow

Indexed keywords

3D NANOSTRUCTURE DESIGN; BULK SILICONS; DESIGN CONFIGURATIONS; ELECTRONIC FUNCTIONS; ENHANCED MOBILITIES; FABRICATION METHODS; HARD MASK; HIGH-TEMPERATURE ANNEALING; HYDROGEN ANNEALING; HYDROGEN ATMOSPHERES; MATERIALS TECHNOLOGIES; NANO-STRUCTURING; SILICON BEAMS; SILICON MEMBRANES; SPECIFIC DESIGNS; VERTICAL DIMENSIONS;

ANNEALING; HYDROGEN; LITHOGRAPHY; NANOSTRUCTURES;

DESIGN;

EID: 67349147064     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.12.083     Document Type: Article

References (7)

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