Reversal μCP using hard stamps

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 650-653

  Bergmair, Iris ^a,b   Mühlberger, Michael ^a   Schwinger, Wolfgang ^a   Hingerl, Kurt ^b   Kley, Ernst Bernhard ^c   Schmidt, Holger ^c   Schöftner, Rainer ^a  

^a PROFACTOR GMBH   (Austria)

^b JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

^c FRIEDRICH SCHILLER UNIVERSITY JENA   (Germany)

Author keywords

Gold structures; Hard stamps; Ormoceres; Reversal CP; Thiols

Indexed keywords

DIFFERENT STRUCTURES; ETCH MASKS; FEATURE SIZES; GOLD STRUCTURES; GOLD SURFACES; HARD STAMPS; MICRO-CONTACT PRINTINGS; NEGATIVE INDEX MATERIALS; ORMOCERES; SOFT STAMPS; SPLIT RING RESONATORS; STAMP MATERIALS; THIOLS; WET-CHEMICAL ETCHINGS;

LITHOGRAPHY; SILICONES;

GOLD;

EID: 67349115200     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.02.020     Document Type: Article

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