A study of filling process for UV nanoimprint lithography using a fluid simulation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7271, Issue , 2009, Pages

  Yoneda, Ikuo ^a   Nakagawa, Yasutada ^a   Mikami, Shinji ^a   Tokue, Hiroshi ^a   Ota, Takumi ^a   Koshiba, Takeshi ^a   Ito, Masamitsu ^a   Hashimoto, Koji ^a   Nakasugi, Tetsuro ^a   Higashiki, Tatsuhiko ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Filling process; Fluid simulation; Nanoimprint lithography; Non fill defect

Indexed keywords

ATMOSPHERE PRESSURE; CAPILLARY FORCE; CD UNIFORMITY; CRITICAL ISSUES; DEFECTIVITY; ENVIRONMENTAL CONDITIONS; FILLING PROCESS; FLUID SIMULATION; FLUID SIMULATIONS; GAS DISSOLUTION; IMPRINT RESIST; NON-FILL DEFECT; PATTERN HEIGHTS; PATTERN SIZE; SIMULATION MODEL; UV NANOIMPRINT LITHOGRAPHY; UV-NANOIMPRINT;

DEFECTS; DISSOLUTION; FILLING; FLUIDS; RISK PERCEPTION;

NANOIMPRINT LITHOGRAPHY;

EID: 67149138451     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.813654     Document Type: Conference Paper

References (5)

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