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International Journal of Materials Research

Volumn 100, Issue 4, 2009, Pages 510-515

Recrystallization initiated by low-temperature grain boundary motion coupled to stress

(2) Cahn, John W a,b Mishin, Yuri c

a UNIVERSITY OF WASHINGTON (United States)

b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (United States)

c GEORGE MASON UNIVERSITY (United States)

Author keywords

Coupled motion; Grain boundary; Grain growth; Recrystallization; Stress

Indexed keywords

APPLIED STRESS; COLD DEFORMATION; COUPLED MOTION; DEFECT-FREE; DEFORMED METALS; DRIVING FORCES; GRAIN BOUNDARY MOTIONS; HIGH ANGLE GRAIN BOUNDARIES; LOW TEMPERATURES; NEW MECHANISMS; NUCLEATION MODELS; RECRYSTALLIZATION; STORED ENERGY;

GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; RECRYSTALLIZATION (METALLURGY); YIELD STRESS;

GRAIN GROWTH;

EID: 67049174166 PISSN: 18625282 EISSN: None Source Type: Journal
DOI: 10.3139/146.110066 Document Type: Article

Times cited : (18)

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