Evaluation of adhesion pull-off performance of nanoparticle-based inkjet-printed silver structure on various substrates

International Journal of Nanotechnology

Volumn 6, Issue 7-8, 2009, Pages 681-690

  Caglar, Umur ^a   Kaija, Kimmo ^a   Mansikkamäki, Pauliina ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Adhesion; Inkjet printing; Nanomaterials; Printable electronics; Pull off strength.

Indexed keywords

ADHESION; INK; INK JET PRINTING; MICROELECTRONICS; NANOSTRUCTURED MATERIALS; PARTICLE SIZE; SINTERING; SURFACE TREATMENT;

ELECTRONICS APPLICATIONS; HIGH-FREQUENCY ELECTRONICS; LOW-COST ELECTRONICS; MICROELECTRONIC CIRCUITS; MICROELECTRONIC PACKAGE; PRINTABLE ELECTRONICS; PULL OFF STRENGTHS; SINTERING TEMPERATURES;

SUBSTRATES;

EID: 66749093554     PISSN: 14757435     EISSN: None     Source Type: Journal    
DOI: 10.1504/IJNT.2009.025306     Document Type: Article

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