Evaluation of a new metrology technique to support the needs of accuracy, precision, speed and sophistication in near-future lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7272, Issue , 2009, Pages

  Ke, Chin Ming ^a   Hu, Jimmy ^a   Wang, Willie ^a   Huang, Jacky ^a   Chung, H L ^a   Liang, C R ^a   Shih, Victor ^a   Liu, H H ^a   Lee, H J ^a   Lin, John ^a   Fan, Y D ^a   Bhattacharyya, Kaustuve ^b   Van Der Schaar, Maurits ^b   Wright, Noelle ^b   Yuan, Kiwi ^b   Wang, Vivien ^b   Wang, Cathy ^b   Lin, Spencer ^b   Shahrjerdy, Mir ^b   Fuchs, Andreas ^b   Van Der Mast, Karel ^b   more..

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^b ASML   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ACCURACY AND PRECISION; DATA COLLECTION; PRODUCTION LAYERS; SCATTEROMETRY; STRINGENT REQUIREMENT; TARGET DESIGN;

LITHOGRAPHY; MEASUREMENTS; TECHNICAL PRESENTATIONS;

PROCESS CONTROL;

EID: 66649115386     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.814860     Document Type: Conference Paper

References (3)

1. Jimmy Hu, C. M. Ke, K. Bhattacharyya et al.: "A comprehensive look at a new metrology technique to support the needs of lithography performance in near future", SPIE Asia (2008)
2. Martin A. van den Brink, "Holistic Lithography Optimization: Wafer Lithography, Computational Lithography and Layout ", plenary presentation, SPIE (2008)
3. Adel M., J.A. Allgair, D. C. Benoit, M. Ghinovker, E. Kassel, C. Nelson, J. C. Robinson, G. S. Seligman, "Performance Study of New Segmented Overlay Marks for Advanced Wafer Processing", Proc. SPIE 5038 (2003)