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Volumn , Issue , 2008, Pages 320-322

A miniaturized CMOS microelectrode array system for single droplet elec-trochemistry applications

Author keywords

CMOS sensor; Electrochemical; Microelectrode array; Potentiostat

Indexed keywords

CMOS INTEGRATED CIRCUITS; DROPS; VOLTAGE REGULATORS;

EID: 65849507870     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (6)
  • 1
    • 33847218640 scopus 로고    scopus 로고
    • Addressable nanoelectrode membrane arrays: Fabrication and steady-state behavior
    • C.G. Zoski, N. Yang, P. He, L. Berdondini and M Koudelka-Hep, Addressable Nanoelectrode Membrane Arrays: Fabrication and Steady-State Behavior, Anal. Chem., 79 (2007).
    • (2007) Anal. Chem. , pp. 79
    • Zoski, C.G.1    Yang, N.2    He, P.3    Berdondini, L.4    Koudelka-Hep, M.5
  • 3
    • 33645163858 scopus 로고    scopus 로고
    • A time-based VLSI potentiostat for ion current measurements
    • H. S. Narula and J. G. Harris, A time-based VLSI potentiostat for ion current measurements, IEEE Sensors Journal, 239-247(2006).
    • (2006) IEEE Sensors Journal , pp. 239-247
    • Narula, H.S.1    Harris, J.G.2
  • 4
    • 26444552080 scopus 로고    scopus 로고
    • The cyclic and linear sweep voltammetry of regular and random arrays of microdisc electrodes: Theory
    • T.J. Davies and R. G. Compton, The cyclic and linear sweep voltammetry of regular and random arrays of microdisc electrodes: Theory, Journal of Electro-analytical Chemistry 585, 2005, pp.63-82.
    • (2005) Journal of Electro-analytical Chemistry , vol.585 , pp. 63-82
    • Davies, T.J.1    Compton, R.G.2
  • 5
    • 0033355776 scopus 로고    scopus 로고
    • Electroless remetallization of alumin-ium bond pads on CMOS driver chip for flip-chip atachment to vertical cavity surface emitting lasers (VCSEL's)
    • Jun
    • Datta, M.; Merritt, A.S.; Dagenais, M., Electroless Remetallization of Alumin-ium Bond Pads on CMOS Driver Chip for Flip-Chip Atachment to Vertical Cavity Surface Emitting Lasers (VCSEL's), IEEE Trans. On Comp. and Pack. Tech., vol. 22, No.2, Jun. 1999, pp. 299-306.
    • (1999) IEEE Trans. on Comp. and Pack. Tech. , vol.22 , Issue.2 , pp. 299-306
    • Datta, M.1    Merritt, A.S.2    Dagenais, M.3
  • 6
    • 51349135505 scopus 로고    scopus 로고
    • The effects of zincation process on aluminium bond pad surfaces for electroless nickel immersion gold (ENIG) deposition
    • Md. Arshad, M.K.; Ahmad, I.; Jalar, A.; Omar, G.; The Effects of Zincation Process on Aluminium Bond Pad Surfaces for Electroless Nickel Immersion Gold (ENIG) Deposition, IEEE Int. Conf. on Semiconductor Electronics, 2004.
    • (2004) IEEE Int. Conf. on Semiconductor Electronics
    • Arshad, M.K.1    Ahmad, I.2    Jalar, A.3    Omar, G.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.