Atomic emission spectroelectrochemistry applied to dealloying phenomena: I. The formation and dissolution of residual copper films on stainless steel

Electrochimica Acta

Volumn 54, Issue 22, 2009, Pages 5163-5170

  Ogle, K ^a   Baeyens, J ^a   Swiatowska, J ^a   Volovitch, P ^a  

^a CNRS   (France)

Author keywords

Copper; ICP OES; Polarization; Selective dissolution; Stainless steel

Indexed keywords

304 STAINLESS STEEL; ANODIC DISSOLUTION; ATOMIC EMISSION; CHLORIDE IONS; COPPER DISSOLUTION; COPPER FILMS; DEALLOYING; DISSOLUTION RATES; ICP-OES; KINETIC MODELS; LINEAR SWEEP VOLTAMMETRY; PASSIVE FILMS; REAL TIME; RESIDUAL COPPER; SELECTIVE DISSOLUTION;

ATOMS; CHROMIUM; COPPER; COPPER COMPOUNDS; COPPER PLATING; INDUCTIVELY COUPLED PLASMA; MANGANESE; MANGANESE COMPOUNDS; METALLIC FILMS; MOLYBDENUM; POLARIZATION; SODIUM CHLORIDE; SPECTROELECTROCHEMISTRY; STAINLESS STEEL; STEEL METALLURGY;

DISSOLUTION;

EID: 65749107391     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2009.01.037     Document Type: Article

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