Development of wireless MEMS inclination sensor system for swing monitoring of large-scale hook structures

IEEE Transactions on Industrial Electronics

Volumn 56, Issue 4, 2009, Pages 1072-1078

  Yu, Yan ^a   Ou, Jinping ^a,b   Zhang, Jun ^c   Zhang, Chunwei ^b   Li, Luyu ^a,d  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

^c SUN YAT SEN UNIVERSITY   (China)

^d UNIVERSITY OF HOUSTON   (United States)

Author keywords

3 D MEMS; Hook structure; Inclination; Structural health monitoring (SHM); Wireless microelectromechanical systems (MEMS) sensor

Indexed keywords

3-D MEMS; DUAL-AXIS; INCLINATION; INCLINATION SENSORS; LASER DISPLACEMENT SENSORS; LONG RANGES; LOW COSTS; MAXIMAL ERRORS; OPERATING PRINCIPLES; POWER UNITS; TUNED MASS DAMPER CONTROLS; WIRELESS COMMUNICATIONS; WIRELESS MEMS; WIRELESS MICROELECTROMECHANICAL SYSTEMS (MEMS) SENSOR;

COMPOSITE MICROMECHANICS; HEALTH; HOOKS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; SENSORS; STRUCTURES (BUILT OBJECTS); THREE DIMENSIONAL;

STRUCTURAL HEALTH MONITORING;

EID: 65549158834     PISSN: 02780046     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIE.2009.2012469     Document Type: Conference Paper

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