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We have also tested a 3×3×1 mesh and we have not found any significant changes in the results.
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We have also tested a 3×3×1 mesh and we have not found any significant changes in the results.
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An atomic process characterized by the diffusion barrier ED can be either operative or suppressed depending on the experimental conditions (temperature T and flux F). Below we consider that T=290 K, F=0.005 ML/sec. The deposition regime examined within out study is characterized by a typical coverage D∼0.01 ML. Therefore, the characteristic time scale tc of the growth process is D/F∼2 sec. The activation time of the atomic process can be estimated using the expression tD ∼ v0 -1 exp (ED / kB T), where v0 =1× 1012 Hz and kB =0.086 meV/K. The considered event is operative only if tD < tc, otherwise it is suppressed. All atomic processes having activation barriers ED > Ecr =0.71 eV are inhibited at T=290 K and F=0.005 ML/sec. The magnitude of the threshold value Ecr depends on T (Ecr decreases with decreasing T) and flux F (Ecr increases with decreasing F).
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An atomic process characterized by the diffusion barrier ED can be either operative or suppressed depending on the experimental conditions (temperature T and flux F). Below we consider that T=290 K, F=0.005 ML/sec. The deposition regime examined within out study is characterized by a typical coverage D∼0.01 ML. Therefore, the characteristic time scale tc of the growth process is D/F∼2 sec. The activation time of the atomic process can be estimated using the expression tD ∼ v0 -1 exp (ED / kB T), where v0 =1× 1012 Hz and kB =0.086 meV/K. The considered event is operative only if tD < tc, otherwise it is suppressed. All atomic processes having activation barriers ED > Ecr =0.71 eV are inhibited at T=290 K and F=0.005 ML/sec. The magnitude of the threshold value Ecr depends on T (Ecr decreases with decreasing T) and flux F (Ecr increases with decreasing F).
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