Controlling electrostatic attraction of particles in production equipment

Semiconductor International

Volumn 22, Issue 8, 1999, Pages

  Cooper, Douglas W ^a,g   Donovan, Robert P ^b,h   Steinman, Arnold ^c,d,e,f  

^a ITW Texwipe   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

^c Ion Systems   (United States)

^d CTO for Ion Systems   (United States)

^e ESO Association

^f POLYTECHNIC UNIVERSITY   (United States)

^g Texwipe Co   (United States)

^h SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROSTATIC ATTRACTION (ESA); ELECTROSTATIC DISCHARGES (ESD);

COMPUTATIONAL METHODS; DEPOSITION; ELECTRIC DISCHARGES; ELECTRIC FIELDS; ELECTROSTATICS; SILICON WAFERS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 6544263142     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)

1. E. Greig, I. Amador and S. Billat, "Controlling Reticle Defects with Conductive Air," presented at the SEMI Ultraclean Manufacturing Symposium, Austin, Texas, October 1994. SEMI.
2. A. Sternman, "Electrostatic Discharge: MR Heads Bewarel" Data Storage, July/ August 1996.
3. T. Murakami, H. Togari, et al , "Electrostatic Problems in TFT-LCD Production and Solutions Using Air Ionization," Proceedings of the EOS/ESD Symposium, Orlando, Fla., September, 1996. ESD Association.
4. D.W. Cooper, R.J. Miller, J.J. Wu and M.H. Peters, "Deposition of Submicron Aerosol Particles During Integrated Circuit Manufacturing Theory," Particulate Sci. Technol. 8 (3 and 4): pp. 209-224 (1990).
5. D.W. Cooper, R.J. Miller, J.J. Wu and M.H. Peters, "Deposition of Submicron Aerosol Particles During Integrated Circuit Manufacturing: Experiments," Journal of Environmental Sciences, 32(1): pp 27, 28, 43-45 (1989).
6. W.J. Fosnight, V.P. Gross, K.D. Murray and R.D. Wang, "Deposition of 0.1 to 1.0 Micron Particles, Including Electrostatic Effects, onto Silicon Monitor Wafers (Experimental)," Microcontamination Conference Proceedings (1993).
7. SEMI Draft Document E78-0998 - "Electrostatic Compatibility - Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment," SEMI (1998).
8. N.A Fuchs, The Mechanics of Aerosols, Pergamon Press, Oxford (1964).
9. National Technology Roadmap for Semiconductors, Semiconductor Industry Association (1997).
10. SEMI E43 - Recommended Practice for Measuring Static Charge on Objects and Surfaces, SEMI.
11. B.Y.H. Liu and K.H. Ahn, "Particle Deposition on Semiconductor Wafers," Aerosol Sci. Technol. 6 pp. 215-224 (1987)
12. E.M. Sparrow and G T. Geiger, "Local and Average Heat Transfer Characteristics for a Disk Situated Perpendicular to a Uniform Flow." J. Heat Transfer 127: pp. 321-326 (1985).
13. G N. Bae, C S Lee and S.O. Park, "Measurement of Particle Deposition Velocity Toward a Horizontal Semiconductor Wafer by Using a Wafer Surface Scanner," Aerosol Sci. Technol., 21: pp. 72-82 (1994).
14. M H Peters and D.W. Cooper, "Approximate Analytical Solutions for Particle Deposition in Viscous Stagnation-Point Flow in the Inertial-Diffusion Regime with External Forces," J. Colloid Interface Sci. 142(1): pp. 140-148 (1991).
15. M D. Oh, K.H. Yoo and H.K. Myong, "Numerical Analysis of Particle Deposition onto Horizontal Freestanding Wafer Surfaces Heated or Cooled," Aerosol Sci. Technol. 25: pp. 141-156 (1996)