Estimating the engineering properties of electronic packaging materials

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 417-424

  Hurley, James M ^a  

^a Advanced Technology Group   (United States)

Author keywords

Encapsulation; Epoxy resins; Least squares methods; Material science and technology; Materials testing; Modeling; Plastic packaging

Indexed keywords

BALL-GRID ARRAYS; COMPOSITE MODULUS; COMPOSITE STIFFNESS; CROSS-LINK DENSITIES; ELECTRONIC PACKAGING MATERIALS; ENGINEERING PROPERTIES; EPOXY COMPOSITES; EXPANSION COEFFICIENTS; GLASS TRANSITION TEMPERATURES; HALPIN-TSAI EQUATIONS; LARGE DATUM; LEAST SQUARES METHODS; MATERIAL SCIENCE AND TECHNOLOGY; MODELING; PLASTIC PACKAGING; POISSON'S RATIOS; RUBBERY PLATEAUS; RUBBERY STATE; RULE OF MIXTURES; SEMI-EMPIRICAL EQUATIONS; SIGMOIDAL FUNCTIONS; SILICA CONTENTS; TRANSITION REGIONS; VISCO ELASTICITIES; WARPAGE; WORKED EXAMPLES;

CURVE FITTING; ELECTRONICS PACKAGING; EPOXY RESINS; GLASS TRANSITION; LEAST SQUARES APPROXIMATIONS; MATERIALS TESTING; PLASTICS; POISSON DISTRIBUTION; POISSON EQUATION; POISSON RATIO; RESINS; SILICA;

PACKAGING MATERIALS;

EID: 65349096996     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.921639     Document Type: Conference Paper

References (35)

1. J. L. Clark, Ed., Structural Design of Polymer Composites. London, U.K.: E&FN Spon, 1996, pp. 412-414.
2. D. W. Van Krevelen, Properties of Polymers, 3rd ed. Amsterdam, The Netherlands: Elsevier, 1990, pp. 71-88.
3. J. Qu and C. P. Wong, "Effective elastic modulus of underfill material for flip-chip applications," IEEE Trans. Compon. Packag. Technol. vol. 25, no. 1, p. 53, Mar. 2002.
4. Plaskon® Technical Bulletins [Online]. Available: http:// www.cooksonsemi.com available online at
5. "Epon Resin Structural Reference Manual," 2008 [Online]. Available: Www.resins.com
6. J. Ogando, "The misunderstood material," Design News Feb. 3, 2004 [Online]. Available: Www.designnews.com/article/CA375676.html, Available online at
7. D. Harris, "Nonlinear least-squares curve fitting with microsoft excel solver," J. Chem. Ed, vol. 75, p. 119, 1998.
8. R. F. Boyer and R. S. Spencer, "Thermal expansion and second-order transitions effects in high polymers-Part I: Experimental results," J. Appl. Phys., vol. 15, pp. 398-1, 1944.
9. R. Simha and R. F. Boyer, "On a general relaxation involving the glass transition and coefficients of expansion of polymers," J. Chem. Phys., vol. 37, p. 1003, 1962.
10. J. T. Seitz, "The estimation of mechanical properties of polymers from molecular structure," J. Appl. Polym. Sci., vol. 49, pp. 1331-1331, 1993.
11. B. L. Burton and J. L. Bertram, "Design of tough epoxy thermosets," in Polymer Toughening, C. B. Arends, Ed. New York: Marcel Dekker, 1996.
12. M. Ogata, N. Kinjo, and T. Kawata, "Effects of crosslinking on physical properties of phenol-formaldehyde novolac cured epoxy resins," J. Appl. Poly. Sci., vol. 48, p. 583, 1993.
13. L. E. Nielsen and R. F. Landel, Mechanical Properties of Polymers and Composites, 2nd ed. New York: Marcel Dekker, 1994, p. 441.
14. S. W. Tsai, "Organic Polymer Matrix," U.S. Government, Tech. Rep. AD 834851, 1968.
15. V. Krevelen, "Molar Rao function and the molar Hartmann function," Tech. Rep., 2008, pp. 373-379.
16. J. T. Seitz, "The estimation of mechanical properties of polymers from molecular structure," J. Appl. Polym. Sci., vol. 49, p. 1331, 1993.
17. "Efunda Polymer Material Properties Database" Tech. Rep., eFunda, Inc., 2008 [Online]. Available: Www.efunda.com
18. T. B. Lewis and L. E. Nielsen, J. Appl. Polymer Sci., vol. 14, p. 1449, 1970.
19. C. S. Tyberg, K. Bergeron, M. Sankarapandian, P. Shih, A. C. Loos, D. A. Dillard, J. E. McGrath, J. S. Riffle, and U. Sorathia, "Structure-property relationships of void-free phenolic-epoxy matrix materials," Polymer, vol. 41, pp. 5053-5062, 2000.
20. S. Stewart, Resolution Performance Products. Houston, TX, 2008, private communication.
21. J. T. Seitz, "The estimation of mechanical properties of polymers from molecular structure," J. Appl. Polym. Sci., vol. 49, p. 1331, 1993.
22. T. W. Clyne, P. J. Withers, Ed., "Chapter 4.1 Elasticity and Residual Stresses," in Encyclopedia of Materials: Science and Technology. Amsterdam, The Netherlands: Elsevier, 2001, p. 6.
23. M. Y. Tsai, W. C. Chiang, T. M. Liu, and G. H. Hsu, "Recent examples include: Thermal deformation measurements and predictions of MAP-BGA electronic packages," Microelect. Rel., vol. 2-4, p. 476, 2006.
24. "FBGA User's Guide, Vers. 4.2," AMD/Fujitsu, Nov. 2002 [Online]. Available: http://askspansion.spansion.com/Packaging/22247j.pdf
25. R. J. Molnar:, "Novel transfer molding technique for encapsulating PBGA packages," in Proc. Pan Pacific Symp. Conf., Maui, HI, Jan. 2000, [CD ROM].
26. W. H. Zhu, G. L. Li, W. Sun, F. X. Che, A. Sun, C. K. Wang, H. B. Tan, B. Z. Zhao, and N. H. Chin, "Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement," in Proc. 8th Int. Conf. Thermal, Mech. Multiphys. Simul. Exper. Micro-Electron. Micro-Syst. (EuroSimE), London, U.K., Apr. 2007, pp. 1-8.
27. W. Yin, H.-S. Hwang, and N.-C. Lee, "Filled no-flow underfilling - Process and materials," in Proc. SMTA Int., Chicago, IL, Sep. 2002, [CD ROM].
28. K. Kitagawa, H. Watanabe, Y. Tachibana, H. Hiragi, and A. Kurita, "Development of innovative composite system-between steel and concrete members," in Proc. Symp. Connections Between Steel Concrete, Stuttgart, Germany, Sep. 2001, p. 1333.
29. Hysol, "Technical Data Sheets," Tech. Rep., 2008 [Online]. Available: http://www.loctite.com/
30. Amicon, "Technical Data Sheets," Tech. Rep., 2008 [Online]. Available: http://www.emersoncuming.com
31. Hitachi, "Molding Compounds, Technical Data Sheets," Tech. Rep., 2008 [Online]. Available: http://www.hitachi-chem.co.jp/
32. Shin-Etsu, "Technical Data," Tech. Rep., 2008 [Online]. Available: http://www.shinetsu-encap-mat.jp/e/index.html
33. J. E. Ashton, J. C. Halpin, and P. H. Petit, Primer on Composite Analysis. Lancaster, PA: Technomic, 1969.
34. J. C. Halpin, J. Compos. Mater., vol. 3, p. 732, 1969.
35. I. R. Chien, J. Zhang, L. Rector, and M. Todd, "Low-warpage molding compound development for array packages," Global SMT Packag., p. 30, Jan. 2007.