Analysis of the growth of individual grains during recrystallization in pure nickel

Acta Materialia

Volumn 57, Issue 9, 2009, Pages 2631-2639

  Zhang, Y B ^a   Godfrey, A ^a   Liu, Q ^b   Liu, W ^a   Juul Jensen, D ^c  

^a TSINGHUA UNIVERSITY   (China)

^b CHONGQING UNIVERSITY   (China)

^c TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Electron backscattering patterns (EBSP); Growth kinetics; Nickel; Recrystallization

Indexed keywords

BOUNDARY MISORIENTATION; BOUNDARY MOBILITIES; ELECTRON BACK-SCATTER PATTERNS; ELECTRON BACKSCATTERING PATTERNS (EBSP); MIGRATION RATES; MIS ORIENTATIONS; MISORIENTATION DISTRIBUTIONS; RECRYSTALLIZATION; SURFACE AREAS;

BACKSCATTERING; BIOACTIVITY; CRACK INITIATION; ELECTRON SCATTERING; GRAIN GROWTH; NICKEL; NICKEL ALLOYS; RECRYSTALLIZATION (METALLURGY);

GROWTH KINETICS;

EID: 64849113243     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.01.039     Document Type: Article

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