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Volumn 517, Issue 13, 2009, Pages 3639-3644

Structural, electrical, and optical properties of copper indium diselenide thin film prepared by thermal evaporation method

Author keywords

Atomic force microscopy; Copper indium diselenide thin film; Electrical characterization; Optical characterization; Thermal evaporation; X ray diffraction

Indexed keywords

ABSORPTION COEFFICIENTS; AFM; ATOMIC-FORCE MICROSCOPIES; BASE PRESSURES; CHALCOPYRITE STRUCTURES; COPPER INDIUM DISELENIDE THIN FILM; DIRECT REACTIONS; ELECTRICAL CHARACTERIZATION; ENERGY DISPERSIVE ANALYSIS OF X-RAYS; GRAIN SIZES; HIGH PURITIES; NEAR STOICHIOMETRIC; OPTICAL AND ELECTRICAL CHARACTERIZATIONS; OPTICAL AND ELECTRICAL PROPERTIES; OPTICAL CHARACTERIZATION; OPTICAL TRANSMISSION MEASUREMENTS; PREFERRED ORIENTATIONS; PULVERIZED MATERIALS; QUARTZ AMPOULES; RESISTIVITY VALUES; SODA LIME GLASS SUBSTRATES; STOICHIOMETRIC COMPOUNDS; SUBSTRATE TEMPERATURES; THERMAL EVAPORATION METHODS; THERMAL EVAPORATION TECHNIQUES; THERMAL-ANNEALING; VACUUM CHAMBERS; XRD;

EID: 64449085034     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.11.133     Document Type: Article
Times cited : (46)

References (16)
  • 6
    • 64449087022 scopus 로고    scopus 로고
    • Powder Diffraction File, Joint Committee on Powder Diffraction Standards, ASTM (1998) (Card no.23-209).
    • Powder Diffraction File, Joint Committee on Powder Diffraction Standards, ASTM (1998) (Card no.23-209).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.