Effect of Ag and Ni particles on mechanical properties and wettability of SnPb composite solder

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 25, Issue 1, 2004, Pages 65-70

  Yan, Yan Fu ^a   Liu, Jian Ping ^a   Shi, Yao Wu ^a   Xia, Zhi Dong ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Composite solders; Mechanical properties; Particles enhanced; Sn Pb solder

Indexed keywords

DISPERSION HARDENING; INTERMETALLICS; MECHANICAL PROPERTIES; NICKEL; SHEAR STRENGTH; SILVER; TENSILE STRENGTH;

COMPOSITE SOLDERS; CREEP RUPTURE LIFE; ELONGATION; METALLURGICAL COALESCENCE; PARTICLES ENHANCING; SPREADING AREAS; TIN LEAD SOLDER; WETTABILITY;

SOLDERING ALLOYS;

EID: 2642523104     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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2. Mei Z, Morris J W, Shine M C. Superplastic creep of eutectic tin lead solder joints [J]. Journal of Electronic Packaging, 1991, 113(6): 109-114.
3. Grivas D, Murty K L, Morris J W. Deformation of Pb-Sn eutectic alloys at relatively high strain rates [J]. Acta Metallurgical, 1979, 27(5): 731-737.
4. Song H G, Morris J W, Hua F. The creep properties of lead-free solder joints [J]. Journal of Minerals, Metals and Materials, 2002, 28(6): 30-32.
5. Noboru Waide, Seiji Yamada, Tatsuo Akusawa. High-strength solder excellent in creep characteristic [P]. Japan, Patent No.: JP11333590.
6. Mavoori H, Jin S. New, creep-resistant, low melting solders with ultrafine oxide dispersions [J]. Journal of Electronic Materials, 1998, 127(11): 1216-1222.