Size effect of indenter on determining modulus of nanowires using nanoindentation technique

Thin Solid Films

Volumn 517, Issue 13, 2009, Pages 3695-3697

  Chang, Neng Kai ^a   Lin, Yong Siang ^a   Chen, Chi Yao ^a   Chang, Shuo Hung ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Copper nanowires; Elastic modulus; Finite element analysis; Nanoindentation

Indexed keywords

BULK VALUES; CONTACT AREAS; COPPER NANOWIRES; FINITE ELEMENT ANALYSIS; FINITE-ELEMENT MODELING; HALF SPACES; INDENTER; NANO-INDENTATION TECHNIQUES; NUMERICAL MODELING; SEMI INFINITES; SIMULATION RESULTS; SIZE EFFECTS;

COPPER; ELASTIC MODULI; ELECTRIC WIRE; MECHANICAL PROPERTIES; NANOINDENTATION; NANOWIRES;

FINITE ELEMENT METHOD;

EID: 64349102976     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.01.094     Document Type: Article

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