Investigations on half-mode substrate integrated waveguide for high-speed interconnect application

2008 IEEE MTT-S International Microwave Workshop Series IMWS on Art of Miniaturizing RF and Microwave Passive Components - Proceeding

Volumn , Issue , 2008, Pages 120-123

  Wei, Ma ^a   Ke, Wu ^a,b   Wei, Hong ^a   Yu Jian, Cheng ^a  

^a SOUTHEAST UNIVERSITY   (China)

^b ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

Author keywords

Bend; Crosstalk; High Speed Interconnects; HMSIW; SIW

Indexed keywords

BAND PASS; BEND; CROSS-TALKS; DIGITAL INTERCONNECTS; GHZ FREQUENCIES; HALF-MODE SUBSTRATE INTEGRATED WAVEGUIDES; HIGH-SPEED; HIGH-SPEED INTERCONNECTS; HIGH-SPEED-INTERCONNECT; HMSIW; LOW LOSS; SIW; STRUCTURE FEATURES; SUBSTRATE-INTEGRATED WAVEGUIDES; ULTRA-HIGH SPEED;

CROSSTALK; MICROWAVES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SPEED; SUBSTRATES; WAVEGUIDES;

MICROWAVE CIRCUITS;

EID: 64049085191     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMWS.2008.4782277     Document Type: Conference Paper

References (8)

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