Coupled molecular dynamics/continuum simulations of Joule heating and melting of isolated copper-aluminum asperity contacts

Modelling and Simulation in Materials Science and Engineering

Volumn 17, Issue 1, 2009, Pages

  Irving, D L ^a   Padgett, C W ^b   Brenner, D W ^a  

^a North Carolina State University   (United States)

^b Armstrong State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; COPPER; DROPS; DYNAMICS; FLOW SIMULATION; HEATING; JOULE HEATING; MELTING; MOLECULAR DYNAMICS;

ALUMINUM MELTS; ALUMINUM SUBSTRATES; ASPERITY CONTACTS; ATOMIC LEVELS; CONSTANT CURRENTS; CONSTANT VOLTAGES; CONTACT AREAS; DISLOCATION EMISSIONS; ELECTRIC CURRENT FLOWS; EMBEDDED-ATOM METHODS; HEAT TRANSPORT EQUATIONS; MELT-SOLID INTERFACES; MOLECULAR DYNAMICS SIMULATIONS; NANO-METER SCALE; NUMERICAL SOLUTIONS; PLASTIC DAMAGES; RESISTOR NETWORKS; VOLTAGE DROPS;

ALUMINUM;

EID: 63749125157     PISSN: 09650393     EISSN: 1361651X     Source Type: Journal    
DOI: 10.1088/0965-0393/17/1/015004     Document Type: Article

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