Kinetics of reactive diffusion between Pd-Ag alloys and Sn at solid-state temperatures

Journal of Alloys and Compounds

Volumn 475, Issue 1-2, 2009, Pages 608-613

  Sakama, T ^a   Kajihara, M ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Grain boundaries; Intermetallics; Metals; Scanning electron microscopy

Indexed keywords

ANNEALING; BINARY ALLOYS; BRAZING; DIFFUSION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GROWTH KINETICS; HEATING; INTERMETALLICS; MECHANICAL PROPERTIES; METAL ANALYSIS; MULTILAYERS; PALLADIUM; PHASE INTERFACES; SCANNING; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING ALLOYS; TIN; TIN ALLOYS; WELDING;

ANNEALING TIME; COMPOUND LAYERS; DIFFUSION BONDING TECHNIQUES; DIFFUSION COUPLES; ELECTRICAL AND MECHANICAL PROPERTIES; ENERGIZATION; FINE PARTICLES; GRAIN SIZES; GROWTH BEHAVIORS; ISOTHERMALLY ANNEALED; PD-AG ALLOYS; PURE SN; REACTIVE DIFFUSIONS; SOLID-STATE TEMPERATURES; TEMPERATURE RANGES; VOLUME DIFFUSIONS;

SILVER;

EID: 63649098948     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.07.113     Document Type: Article

References (33)

1. Zakraysek L. Welding Research Supplement Nov. (1972) 536
2. Tu K.N. Acta Metall. 21 (1973) 347
3. Onishi M., and Fujibuchi H. Trans. JIM 16 (1975) 539
4. Keller H.N. IEEE Trans. Components, Hybrids, Manuf. Tech. CHMT-2 (1979) 180
5. Keller H.N., and Morabito J.M. Surf. Interface Anal. 3 (1981) 16
6. Parent J.O.G., Chung D.D.L., and Bernstein I.M. J. Mater. Sci. 23 (1988) 2564
7. Sunwoo A.J., Morris Jr. J.W., and Lucey Jr. G.K. Metall. Trans. A 23A (1992) 1323
8. Vianco P.T., Hlava P.F., and Kilgo A.L. J. Electron. Mater. 23 (1994) 583
9. Frear D.R., and Vianco P.T. Metall. Trans. A 25A (1994) 1509
10. Choi S., Bieler T.R., Lucas J.P., and Subramanian K.N. J. Electron. Mater. 28 (1999) 1209
11. Takenaka T., Kano S., Kajihara M., Kurokawa N., and Sakamoto K. Mater. Sci. Eng. A 396 (2005) 115
12. Wright C. IEEE Trans. Parts, Hybrids, Packaging PHP-13 (1977) 202
13. Keller H.N. IEEE Trans. Components, Hybrids, Manuf. Tech. CHMT-5 (1982) 408
14. Hannech E.I.-B., and Hall C.R. Mater. Sci. Tech. 8 (1992) 817
15. Ghosh G. Acta Mater. 48 (2000) 3719
16. Kajihara M., Yamada T., Miura K., Kurokawa N., and Sakamoto K. Netsushori 43 (2003) 297
17. Yamada T., Miura K., Kajihara M., Kurokawa N., and Sakamoto K. J. Mater. Sci. 39 (2004) 2327
18. Yamada T., Miura K., Kajihara M., Kurokawa N., and Sakamoto K. Mater. Sci. Eng. A 390 (2005) 118
19. Kajihara M., and Takenaka T. Mater. Sci. Forum 539-543 (2007) 2473
20. Takenaka T., Kajihara M., Kurokawa N., and Sakamoto K. Mater. Sci. Eng. A 406 (2005) 134
21. Suzuki K., Kano S., Kajihara M., Kurokawa N., and Sakamoto K. Mater. Trans. 46 (2005) 969
22. Massalski T.B., Okamoto H., Subramanian P.R., and Kacprzak L. Binary Alloy Phase Diagrams, vol. 1 (1990), ASM International, Materials Park, OH p. 12
23. Takenaka T., Kano S., Kajihara M., Kurokawa N., and Sakamoto K. Mater. Trans. 46 (2005) 1825
24. Takenaka T., Kano S., Kajihara M., Kurokawa N., and Sakamoto K. Mater. Sci. Eng. A 427 (2006) 210
25. Massalski T.B., Okamoto H., Subramanian P.R., and Kacprzak L. Binary Alloy Phase Diagrams, vol. 1 (1990), ASM International, Materials Park, OH p. 74
26. Corcoran Y.L., King A.H., de Lanerolle H., and Kim B. J. Electron. Mater. 19 (1990) 1177
27. Furuto A., and Kajihara M. Mater. Trans. 49 (2008) 294
28. Kajihara M. Acta Mater. 52 (2004) 1193
29. Kajihara M. Mater. Sci. Eng. A 403 (2005) 234
30. Kajihara M. Defect Diffusion Forum 249 (2006) 91
31. Kajihara M. Mater. Trans. 46 (2005) 2142
32. Kajihara M. Mater. Trans. 47 (2006) 1480
33. Kajihara M., and Yamashina T. J. Mater. Sci. 42 (2007) 2432