The challenge to implement thin wafer potential with wire saw cutting technology

Proceedings of the 3rd World Conference on Photovoltaic Energy Conversion

Volumn B, Issue , 2003, Pages 1475-1478

  Mueller, André ^a   Cherradi, Nabih ^a   Nasch, Philippe M ^a  

^a HCT Shaping Systems SA   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

FREE-ABRASIVE SLICING TECHNOLOGY; MULTI-WIRE SLURRY SAW (MWS); TOTAL THICKNESS VARIATION (TTV); WAFER LOSS;

DATA ACQUISITION; PHOTOVOLTAIC EFFECTS; POLYSILICON; SILICON SOLAR CELLS; SINGLE CRYSTALS; SURFACE TENSION;

SILICON WAFERS;

EID: 6344253229     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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6. th European Photovoltaic Solar Energy Conference, pp. 1519-1522, Vol.II, 22-26 October 2001, Munich, D.
7. F.A. Tony Schraub, "Automated Handling of Ultra-Thin Silicon Wafers", Solid State Technology, September 2002
8. C. Hauser and P. M. Nasch, "Advanced Slicing Techniques for Single Crystals", in Crystal Growth Technology, Eds. H. J. Scheel and T. Fukuda, (Wiley), in press.
9. C. Hauser and P. M. Nasch, "Slicing Technology and Thin Wafer", Workshop «Dependable and Economic Silicon Materials Supply for Solar Cell Production», December 7-12, 1998, JRC-Ispra, Italy.