Automated handling of ultra-thin silicon wafers

Solid State Technology

Volumn 45, Issue 9, 2002, Pages 59-60+62+64

  Schraub, F A Tony ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FACTORY AUTOMATION; PRODUCTION; STRESSES; SURFACE TENSION; ULTRATHIN FILMS;

AUTOMATED HANDLING; THINNING; ULTRATHIN SILICON WAFERS; WARP;

SILICON WAFERS;

EID: 0036747422     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. J. Carson, Paper No. 3 presented at MEPTEC Symposium, Feb. 2002, Sunnyvale, CA (available on CD ROM).
2. M. Robinson, Paper No. 5, presented at MEPTEC Symposium, February 2002, Sunnyvale, CA.
3. C. Somasundaram, et al., 6th Int'l Conference on Progress of Machining Technology, September 2002, Xi'an, Shanxi, China.
4. C. Landesberger, et al., Paper No. 3, Session No. 3, workshop at Thin Semiconductor Devices-Manufacturing and Applications, Dec. 2001, Munich (available on CD ROM).
5. Specific contacts are Ken Schramko (kschramko@semi.org), standards engineer, regarding SEMI and SEMICON meetings about standards for thin wafers, and Win Baylies (winb@attbi.com) regarding the bare wafer task force.