Practical techniques for measuring MEMS properties

2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004

Volumn 1, Issue , 2004, Pages 402-405

  Clark, J V ^a   Garmire, D ^a   Last, M ^a   Demmel, J ^a   Govindjee, S ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Characterization; Metrology; Property extraction

Indexed keywords

CAPACITANCE; DAMPING; ELASTIC MODULI; ERROR ANALYSIS; ETCHING; LIGHT; LOGIC DESIGN; POISSON RATIO; STANDARDS; TESTING;

CHARACTERIZATION METHODS; METROLOGY METHODS; PROPERTY EXTRACTION;

MICROELECTROMECHANICAL DEVICES;

EID: 6344243365     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Small Times, "MEMS Standards, While Small, May Mean Much for the Industry," Aug 26, 2003
2. J. Marshall, NIST, Gaithersburg, Md. www.astm.org/SNEWS/OCTOBER_2003/ micro_oct03.html
3. P. M. Osterberg, S. D. Senturia, "M-Test: A Test Chip for MEMS Material Property Measurement Using Electrostatically Actuated Test Structures," JMEMS, June 1997, v.6, no.2:107-118
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5. K. E. Peterson, et al., "Young's Modulus Measurements of Thin Films Using Micromechanics," J. Appl. Physics, 50, 1979, pp6761-6766.
6. L. Lin, et. al., "A Micro Strain Gauge with Mechanical Amplifier" JMEMS, 6, 1997, pp313-321.
7. W. Sharpe Jr., "Mechanical Properties of MEMS Materials" The MEMS Handbook, 2002, Ch3 pp1-33.
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9. S. D. Senturia, "Microsystem Design," Kluwer, 2001.
10. M. Elwenspoek, R. J. Wiergerink, Mechanical Microsensors, Berlin, New York, Springer, 2001.
11. R. K. Gupta, "Electronically Probed Measurements of MEMS Geometries," JMEMS v.9, no.3, 2000, p380.
12. J. Green, et. al., "New iMEMS Angular Rate-Sensing Gyroscope," Analog Devices, Dialogue, 37-03, 2003.
13. J. V. Clark, dissertation in progress, "Modeling, Simulation, and Design of Complex Microelectro-mechanical Systems," U.C. Berkeley, CA.