Non-equilibrium thermodynamic theory of 4-component lead-free solder

Materials Transactions

Volumn 50, Issue 2, 2009, Pages 236-244

  Suetsugu, Kenichiro ^a   Yamaguchi, Atsushi ^a   Matsushige, Kazumi ^b   Horiuchi, Toshihisa ^b  

^a PANASONIC CORPORATION   (Japan)

^b KYOTO UNIVERSITY   (Japan)

Author keywords

Material design technology; Melting temperature forecast of lead free solder; Non equilibrium thermodynamics

Indexed keywords

BRAZING; CALORIMETRY; MELTING POINT; METAL MELTING; METALLIC COMPOUNDS; OSCILLATORS (MECHANICAL); SEMICONDUCTOR MATERIALS; SOLDERING ALLOYS; SPECIFIC HEAT; THERMAL EXPANSION; THERMAL STRESS; THERMODYNAMIC STABILITY; THERMODYNAMICS; TIN; WELDING;

CLASSICAL THERMODYNAMICS; COEFFICIENT OF LINEAR THERMAL EXPANSIONS; EUTECTIC SOLDERS; HIGH TEMPERATURES; LEAD-FREE MATERIALS; MATERIAL DESIGN TECHNOLOGY; MELTING TEMPERATURE FORECAST OF LEAD-FREE SOLDER; NON EQUILIBRIUMS; NON-EQUILIBRIUM STATE; NON-EQUILIBRIUM THERMODYNAMICS; ONE-DIMENSIONAL; OSCILLATOR MODELS; THERMODYNAMIC CHARACTERISTICS; THERMODYNAMIC THEORIES;

LEAD;

EID: 63149177205     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MRA2008094     Document Type: Article

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