Standards for tin whisker test methods on lead-free components

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 1, 2009, Pages 216-219

  Shibutani, Tadahiro ^a   Osterman, Michael ^c   Pecht, Michael ^b,c  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

Environmental test; Lead free electronics; Standard; Tin whisker

Indexed keywords

ENVIRONMENTAL TESTING; STANDARDS; TIN; TITANIUM COMPOUNDS;

ACCELERATION TRANSFORMS; ACCEPTANCE CRITERION; DATA COLLECTIONS; ELECTRONIC COMPONENTS; ENVIRONMENTAL TEST; KEY PROBLEMS; LEAD-FREE; LEAD-FREE COMPONENTS; LEAD-FREE ELECTRONICS; LEAD-FREE FINISHES; TEST METHODS; TIN WHISKER;

CRYSTAL WHISKERS;

EID: 63049139479     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2013311     Document Type: Article

References (9)

1. K. G. Campton, A. Mendizza, and S. M. Arnold, "Filamentary Growth on Metal Surfaces - 'Whiskers'," Corrosion, vol. 7, pp. 327-334, 1951.
2. Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes, JEDEC Standard JESD22A121A, 2008.
3. Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes, JEDEC Standard JESD201, 2006.
4. Whisker Test Methods on Components for Use in Electrical and Electronic Equipment, JEITA Standard ET-7410, (in Japanese), 2005.
5. Whisker Test Methods on Connectors for Use in Electrical and Electronic Equipment, JEITA Standard RC-5241, (in Japanese), 2007.
6. Whisker Test Methods for Electronic and Electric Components, IEC Standard IEC60068-2-82, Edition 1.0, 2007.
7. Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems, GEIA Standard GEIA-STD-0005-2, 2006.
8. M. Osterman, "Tin Whisker Growth Measurements and Observations," in Proc. 2nd Int. Symp. Tin Whiskers, Tokyo, Japan, 2008, 1-1-1.
9. T. Fang, M. Osterman, and M. Pecht, "Statistical analysis of tin whisker growth," Microelectron. Rel., vol. 46, no. 5-6, pp. 846-849, 2006.