Reliability of flexible display by simulation and strain gauge test

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 322-327

  Chen, Quayle ^a   Xu, Leon ^a   Salo, Antti ^a   Neto, Gustavo ^b   Freitas, Germano ^b  

^a Nokia System Research Center (NRC Beijing)   (China)

^b Nokia Technology Institute (INdT)   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; RELIABILITY; ROLLERS (MACHINE COMPONENTS); STRAIN GAGES;

ELECTRONIC COMPONENTS; FABRICATING PROCESS; FABRICATION PROCESS; FLEXIBLE DISPLAYS; NEW MATERIALS; SIMULATION MODELS; SIMULATION RESULTS; STRAIN GAUGE TESTS; STRAIN GAUGES; SUBSTRATE MATERIALS; THREE-POINTS BENDING;

TECHNOLOGY;

EID: 63049132560     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763455     Document Type: Conference Paper

References (7)

1. T. Sakai, A.J.J. van der Horst etc, "A Study on Roll-to-Roll Method for Flexible TFT Backplane Manufacturing", IDW'07, pp. 137-140.
2. Sonia Grego, Jay Lewis etc, "Development and evaluation of bend-testing techniques for flexible-display", Journal of the SID 13/7 (2005).
3. Peter J. Slikkerveer, "Bending the display rules: Options and Challenges for Flexible Displays", EURODISPLAY 2002, pp. 273-276.
4. T. Sakai, A.J.J. van der Horst etc, "A Study on Roll-to-Roll Method for Flexible TFT Backplane Manufacturing", IDW'07, pp. 137-140.
5. National Instruments, "The Measurement and Automation catalog 2000", pp. 345.
6. Strain Gauge Measurement - A Tutorial, National Instruments Guide.
7. Mulugeta Abtew and Guna selvaduray, "Lead-free in Microelectronics" Materials science and Engineering, 2000, pp. 95-141.