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Volumn , Issue , 2008, Pages 344-349
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Low cost printed flexible multilayer substrates
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ALIGNMENT;
CHIP SCALE PACKAGES;
CURING;
ELECTRONIC EQUIPMENT MANUFACTURE;
INK;
LAMINATING;
LIGHT SOURCES;
LIQUID CRYSTAL POLYMERS;
LIQUID CRYSTALS;
METAL CLADDING;
MULTILAYERS;
NANOPARTICLES;
POLYETHYLENE TEREPHTHALATES;
POLYIMIDES;
POLYMERS;
POSITRON EMISSION TOMOGRAPHY;
SCREEN PRINTING;
SILVER;
TECHNOLOGY;
THICK FILMS;
ADHESIVE LAYERS;
ALIGNMENT ACCURACIES;
CONDUCTOR LAYERS;
CONDUCTOR MATERIALS;
CONDUCTOR SYSTEMS;
COST-EFFICIENT;
CURING TEMPERATURES;
DIELECTRIC LAYERS;
DIFFERENT SUBSTRATES;
FLEXIBLE SUBSTRATES;
LAMINATION PARAMETERS;
LAMINATION PROCESS;
LAYER ALIGNMENTS;
LINE PATTERNING;
LOW COSTS;
MASS PRODUCTIONS;
MATERIAL SYSTEMS;
MOBILE TERMINALS;
MULTI-LAYER STRUCTURES;
MULTILAYER SUBSTRATES;
POLYETHYLENE TEREPHTALATE;
POLYIMIDE SUBSTRATES;
POLYMER SUBSTRATES;
POLYMER THICK FILMS;
PRINTED MATERIALS;
PRINTING RESOLUTIONS;
THICK-FILM;
THROUGH-HOLE VIAS;
WIRING BOARDS;
SUBSTRATES;
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EID: 63049131999
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2008.4763458 Document Type: Conference Paper |
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Times cited : (9)
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References (2)
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