Multilayer flexible wiring board based on screen printed conductors

16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007

Volumn , Issue , 2007, Pages 595-600

  Petaja J ^a   Kautio, K ^a   Funck, H ^b   Karppinen, M ^a   Karioja, P ^a   Vatanparast, R ^b  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Dielectric ink; Electrical via; Nanoparticle ink; Polymer thick film paste

Indexed keywords

ALIGNMENT TOLERANCE; DIFFERENT SUBSTRATES; ELECTRICAL VIA; NANOPARTICLE INKS; POLYETHYLENE TEREPHTALATE; POLYIMIDE SUBSTRATE; POLYMER THICK FILMS; PRINTING RESOLUTION;

CHIP SCALE PACKAGES; CURING; EXHIBITIONS; LIQUID CRYSTAL POLYMERS; MICROELECTRONICS; MULTILAYERS; NANOPARTICLES; POLYIMIDES; SCREEN PRINTING; SILVER; THICK FILMS;

SUBSTRATES;

EID: 84875353136     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Polymer Thick Film, Ken Gilleo, 1996.