Mold temperature variation for assisting micro-molding of DVD micro-featured substrate and dummy using pulsed cooling

Sensors and Actuators, A: Physical

Volumn 151, Issue 1, 2009, Pages 87-93

  Chen, Shia Chung ^a   Wang, Ying Cheih ^a   Liu, Sung Chih ^a   Cin, Jin Chuan ^a  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

Author keywords

Micro molding; Mold temperature variation; Pulsed cooling

Indexed keywords

COOLANTS; COOLING; DATA STORAGE EQUIPMENT; INJECTION MOLDING; MOLDS; VIDEODISKS;

CAVITY SURFACES; CDS; CELLULAR PHONES; COMMERCIAL APPLICATIONS; COOLANT TEMPERATURES; COOLING CIRCUITS; COOLING TECHNOLOGIES; CYCLE TIME; DEFLECTION PROPERTIES; DIMENSIONAL ACCURACIES; FILLING PROCESS; FILLING STAGES; MICRO FEATURES; MICRO-MOLDING; MOLD TEMPERATURE VARIATION; PART QUALITIES; PULSED COOLING; THIN-WALL PARTS; VARIABLE MOLD TEMPERATURES;

SUBSTRATES;

EID: 63049127377     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.02.015     Document Type: Article

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