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Volumn 30, Issue 1, 2009, Pages 197-200

Effect of particle on thermal residual stress in aluminum matrix composite

Author keywords

Aluminum matrix composite; Finite element method; SiC particle; Thermal residual stress

Indexed keywords

ALUMINA; ALUMINUM; METALLIC MATRIX COMPOSITES; RESIDUAL STRESSES; SILICON CARBIDE; STRENGTH OF MATERIALS; STRESS CONCENTRATION; TITRATION;

EID: 62549086178     PISSN: 10096264     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (13)

References (14)
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  • 3
    • 58149307472 scopus 로고    scopus 로고
    • AlSiC metal matrix composites and its application in microelectronics packaging
    • LONG Le. AlSiC metal matrix composites and its application in microelectronics packaging [J]. Electronics & Packaging, 2006, (6): 16-20.
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  • 4
    • 0942280633 scopus 로고    scopus 로고
    • Advanced materials for optoelectronic packaging
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  • 5
    • 0037427586 scopus 로고    scopus 로고
    • Behavior of SiC reinforced 2124 Al alloy composite in RWAT system
    • Izciler M, Muratoglu M. Behavior of SiC reinforced 2124 Al alloy composite in RWAT system [J]. Journal of Materials Processing Technology, 2003, 132 (1-3): 67-72.
    • (2003) Journal of Materials Processing Technology , vol.132 , Issue.1-3 , pp. 67-72
    • Izciler, M.1    Muratoglu, M.2
  • 6
    • 0037472263 scopus 로고    scopus 로고
    • Thermal expansion and thermal mismatch stress relaxation behaviors of SiC reinforced aluminum composite
    • Fei W D, Hu M, Yao C K. Thermal expansion and thermal mismatch stress relaxation behaviors of SiC reinforced aluminum composite [J]. Materials Chemistry and Physics, 2002, 77: 882-888.
    • (2002) Materials Chemistry and Physics , vol.77 , pp. 882-888
    • Fei, W.D.1    Hu, M.2    Yao, C.K.3
  • 7
    • 62549155293 scopus 로고    scopus 로고
    • Development of mechanics model of thermal residual stress in metal matrix composites
    • WU Jing, LI Wen-fang, MENG Ji-long. Development of mechanics model of thermal residual stress in metal matrix composites [J]. Materials Science and Engineering, 2003, 21 (2): 289-292.
    • (2003) Materials Science and Engineering , vol.21 , Issue.2 , pp. 289-292
    • Wu, J.1    Li, W.-F.2    Meng, J.-L.3
  • 8
    • 0037591553 scopus 로고    scopus 로고
    • Thermal stress analysis in particulate composite components
    • Capela C. Thermal stress analysis in particulate composite components [J]. Strain, 2003, 39: 49-56.
    • (2003) Strain , vol.39 , pp. 49-56
    • Capela, C.1
  • 10
    • 62549148995 scopus 로고    scopus 로고
    • Chinese source
  • 11
    • 62549149393 scopus 로고    scopus 로고
    • Current status of research on electronic packaging materials
    • HUANG Qiang, GU Ming-yuan, JIN Yan-ping. Current status of research on electronic packaging materials [J]. Journal of Materials, 2000, 14 (9): 28-32.
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  • 13
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    • Finite element analysis of the effect of particle shape on the thermal residual stress in Al matrix composites
    • HAN Yuan-yuan, LI Feng-zhen, WU Gao-hui, et al. Finite element analysis of the effect of particle shape on the thermal residual stress in Al matrix composites [J]. Journal of Harbin University of Science and Technology, 2003, 8 (5): 83-87.
    • (2003) Journal of Harbin University of Science and Technology , vol.8 , Issue.5 , pp. 83-87
    • Han, Y.-Y.1    Li, F.-Z.2    Wu, G.-H.3
  • 14
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    • Finite element modeling of the residual thermal stresses in multiphase composite ceramic tool material
    • XU Chong-hai, SUN De-ming, FENG Yan-xia. Finite element modeling of the residual thermal stresses in multiphase composite ceramic tool material [J]. Acta Material Composite Sinica, 2001, 18 (3): 91-96.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.