-
1
-
-
0036622598
-
Aerospace applications of silicon carbide particulate reinforced aluminium matrix composites
-
CUI Yan. Aerospace applications of silicon carbide particulate reinforced aluminium matrix composites [J]. Journal of Materials Engineering, 2002 (6): 3-6.
-
(2002)
Journal of Materials Engineering
, Issue.6
, pp. 3-6
-
-
Cui, Y.1
-
3
-
-
58149307472
-
AlSiC metal matrix composites and its application in microelectronics packaging
-
LONG Le. AlSiC metal matrix composites and its application in microelectronics packaging [J]. Electronics & Packaging, 2006, (6): 16-20.
-
(2006)
Electronics & Packaging
, Issue.6
, pp. 16-20
-
-
Long, L.1
-
4
-
-
0942280633
-
Advanced materials for optoelectronic packaging
-
Carl Zweben. Advanced materials for optoelectronic packaging [J]. Optoelectronics, 2002 (9): 37-40.
-
(2002)
Optoelectronics
, Issue.9
, pp. 37-40
-
-
Zweben, C.1
-
5
-
-
0037427586
-
Behavior of SiC reinforced 2124 Al alloy composite in RWAT system
-
Izciler M, Muratoglu M. Behavior of SiC reinforced 2124 Al alloy composite in RWAT system [J]. Journal of Materials Processing Technology, 2003, 132 (1-3): 67-72.
-
(2003)
Journal of Materials Processing Technology
, vol.132
, Issue.1-3
, pp. 67-72
-
-
Izciler, M.1
Muratoglu, M.2
-
6
-
-
0037472263
-
Thermal expansion and thermal mismatch stress relaxation behaviors of SiC reinforced aluminum composite
-
Fei W D, Hu M, Yao C K. Thermal expansion and thermal mismatch stress relaxation behaviors of SiC reinforced aluminum composite [J]. Materials Chemistry and Physics, 2002, 77: 882-888.
-
(2002)
Materials Chemistry and Physics
, vol.77
, pp. 882-888
-
-
Fei, W.D.1
Hu, M.2
Yao, C.K.3
-
7
-
-
62549155293
-
Development of mechanics model of thermal residual stress in metal matrix composites
-
WU Jing, LI Wen-fang, MENG Ji-long. Development of mechanics model of thermal residual stress in metal matrix composites [J]. Materials Science and Engineering, 2003, 21 (2): 289-292.
-
(2003)
Materials Science and Engineering
, vol.21
, Issue.2
, pp. 289-292
-
-
Wu, J.1
Li, W.-F.2
Meng, J.-L.3
-
8
-
-
0037591553
-
Thermal stress analysis in particulate composite components
-
Capela C. Thermal stress analysis in particulate composite components [J]. Strain, 2003, 39: 49-56.
-
(2003)
Strain
, vol.39
, pp. 49-56
-
-
Capela, C.1
-
10
-
-
62549148995
-
-
Chinese source
-
-
-
-
11
-
-
62549149393
-
Current status of research on electronic packaging materials
-
HUANG Qiang, GU Ming-yuan, JIN Yan-ping. Current status of research on electronic packaging materials [J]. Journal of Materials, 2000, 14 (9): 28-32.
-
(2000)
Journal of Materials
, vol.14
, Issue.9
, pp. 28-32
-
-
Huang, Q.1
Gu, M.-Y.2
Jin, Y.-P.3
-
13
-
-
62549084254
-
Finite element analysis of the effect of particle shape on the thermal residual stress in Al matrix composites
-
HAN Yuan-yuan, LI Feng-zhen, WU Gao-hui, et al. Finite element analysis of the effect of particle shape on the thermal residual stress in Al matrix composites [J]. Journal of Harbin University of Science and Technology, 2003, 8 (5): 83-87.
-
(2003)
Journal of Harbin University of Science and Technology
, vol.8
, Issue.5
, pp. 83-87
-
-
Han, Y.-Y.1
Li, F.-Z.2
Wu, G.-H.3
-
14
-
-
19044397570
-
Finite element modeling of the residual thermal stresses in multiphase composite ceramic tool material
-
XU Chong-hai, SUN De-ming, FENG Yan-xia. Finite element modeling of the residual thermal stresses in multiphase composite ceramic tool material [J]. Acta Material Composite Sinica, 2001, 18 (3): 91-96.
-
(2001)
Acta Material Composite Sinica
, vol.18
, Issue.3
, pp. 91-96
-
-
Xu, C.-H.1
Sun, D.-M.2
Feng, Y.-X.3
|