High-speed optical three-dimensional scanner for automatic solder joint inspection

Optical Engineering

Volumn 36, Issue 10, 1997, Pages 2878-2885

  Schneider, Richard ^a,b,d,e   Schick, Anton ^b,d,f   Köllensperger, Paul ^b,d   Ninomiya, Takanori ^c,g,h  

^a SPIE   (Germany)

^b SIEMENS AG   (Germany)

^c HITACHI LTD   (Japan)

^d TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^e TU DORTMUND UNIVERSITY   (Germany)

^f Siemens Corp Prod Logistics Div

^g OSAKA UNIVERSITY   (Japan)

^h IEEE   (Japan)

Author keywords

Automatic optical inspection; Confocal microscopes; Image processing; Lens design; Multichip modules; Solder joints; Three dimensional scanners

Indexed keywords

EID: 6244299548     PISSN: 00913286     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.601412     Document Type: Article

References (11)

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