Automated solder joint inspection system using optical 3-D image detection

IEEE Workshop on Applications of Computer Vision - Proceedings

Volumn , Issue , 1996, Pages 116-122

  Matsuyama, Yukio ^a   Honda, Toshifumi ^a   Yamamura, Hisae ^a   Sasazawa, Hideaki ^a   Nomoto, Mineo ^a   Ninomiya, Takanori ^a   Schick, Anton ^a   Listl, Ludwig ^a   Koellensperger, Paul ^a   Spriegel, Dieter ^a   Mengel, Peter ^a   Schneider, Richard ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; COMPUTER VISION; ELECTRONICS PACKAGING; FEATURE EXTRACTION; IMAGE SENSORS; INSPECTION; PATTERN RECOGNITION SYSTEMS; REAL TIME SYSTEMS; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL COMPUTER GRAPHICS; USER INTERFACES;

CONFOCAL MICROSCOPE; QUAD FLAT PACKAGES (QFP); SOLDER JOINTS INSPECTION SYSTEMS; THREE DIMENSIONAL IMAGE DETECTION;

SOLDERED JOINTS;

EID: 0030396990     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)