Microwave 3D concept for beam forming networks

European Space Agency, (Special Publication) ESA SP

Volumn , Issue 507, 2002, Pages 221-225

  Vendier, Olivier ^a   Drevon, Claude ^a   Monfraix, Philippe ^a  

^a THALES ALENIA SPACE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; ENCAPSULATION; FREQUENCIES; MATRIX ALGEBRA; PRINTED CIRCUIT BOARDS; RELIABILITY; SATELLITES; SPACE APPLICATIONS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; THREE DIMENSIONAL; WAVEGUIDES;

ACTIVE ANTENNAS; BEAM FORMING NETWORKS; MICROCONNECTORS;

MICROWAVE ANTENNAS;

EID: 0037004357     PISSN: 03796566     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. C. Val et al., "3-D interconnection for ultra-dense multichip modules", Components, Hybrids, and Manufacturing Technology, IEEE Transactions on [see also IEEE Trans. on Components, Packaging, and Manufacturing Technology, Part A, B, C], Volume: 13 Issue: 4, Dec. 1990, pp. 814-821
2. J. Barrett et al., "Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V)", Electronic Components and Technology Conference 1995 Proceedings., 45th, 1995, pp. 656-663
3. P. Ulian et al., "3D active modules for high integration active antennas", 28th EuMC 98, vol.1, pp. 271-276, 1998.
4. P. Monfraix et al., "3D Microwave Modules for Space", 1998 IEEE MTT-S International Microwave Symposium Digest - p. 1289-1292
5. C. Drevon., "Multilayer Printed Circuit Board at 12-14 GHz with MCMs and MMICs", 1999 Wireless Workshop Proceedings, Gold Canyon - Arizona - p. 6-9
6. O. Vendier et al., "3D Beam Forming Network for High Integration Active Antennas", 29th EuMC 99, vol.3., pp. 379-381, 1999