Sub-μ structured Lotus Surfaces manufacturing

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2008, Pages 330-334

  Worgull, M ^a   Heckele, M ^a   Mappes, T ^b   Matthis, B ^a   Tosello, G ^c   Metz, T ^d   Gavillet, J ^e   Koltay, P ^d   Hansen, H N ^c  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b UNIVERSITY OF KARLSRUHE   (Germany)

^c TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^d UNIVERSITY OF FREIBURG   (Germany)

^e DIF   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; FLUIDICS; MEMS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; POLYMER FILMS;

FEATURE SIZES; FUNCTIONAL LAYERS; HIGH ASPECT RATIOS; MICRO STRUCTURES; MICRO-FLUIDICS; MOLD INSERTS; PROCESS CHAINS; STOCHASTIC METHODS; STRUCTURED SURFACES;

STRUCTURAL DESIGN;

EID: 62249178599     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2008.4753012     Document Type: Conference Paper

References (7)

1. J. Tsibouklis et al., Poly(perfluoroalkyl methacrylate) Film Structures: Surface Organization Phenomena, Surface Energy Determinations, and Force of Adhesion Measurements, Macromolecules, 33:22, 8460-8465 (2000).
2. C.G.L. Furmidge, Studies at phase interfaces. I. The sliding of liquid drops on solid surfaces and a theory for spray retention, Journal of Colloid Science, 17:4, 309-324 (1962).
3. M. Miwa et al., Effects of the surface roughness on sliding angles of water droplets on superhydrophobic surfaces, Langmuir, 16:13, 5754-5760 (2000).
4. R.E. Johnson, R.H. Dettre, Contact angle hysteresis. I. Study of an idealized rough surface, Adv. Chem. Ser., 43, 112 (1964).
5. A.B.D. Cassie and S. Baxter, Wettability of porous surfaces, Transactions of the Faraday Society, 40, 546-551 (1944).
6. M. Heckele, W.K. Schomburg, "Review on Micro Molding of Thermoplastic Polymers", Journal of Micromechanics and Microengineering", 14(2004) R1-R14
7. M. Worgull, J.-F. Hetu, K.K. Kabanemi, M. Heckele, "Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication", J. Microlith., Microfab., Microsyst. 5(1), 011005 (Jan-Mar 2006)