Interfacial bonding strength between brazing alloys and CVD diamond

Journal of Materials Engineering and Performance

Volumn 18, Issue 3, 2009, Pages 312-318

  Hsieh, Yu Chan ^a   Lin, Shun Tian ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Brazing; Heat treating; Joining; Material selection

Indexed keywords

ACTIVE METALS; BOND STRENGTHS; BONDING STRENGTHS; BRAZING ALLOYS; COPPER-BASED; CVD DIAMONDS; HEAT TREATING; HIGH CONCENTRATIONS; HIGH TEMPERATURES; INTERFACIAL BONDING STRENGTHS; INTERMETALLIC COMPOUNDS; LOW CONCENTRATIONS; MATERIAL SELECTION; NICKEL-BASED ALLOYS; VISIBLE DEGRADATIONS;

ALUMINUM; BRAZING; CHEMICAL VAPOR DEPOSITION; CHROMIUM; DIAMONDS; DIFFUSION BONDING; HEAT TREATING FURNACES; HEAT TREATMENT; INTERMETALLICS; IRON ALLOYS; JOINING; METALS; NICKEL; NICKEL ALLOYS; PRECIPITATION (CHEMICAL); SILVER; SILVER ALLOYS; TIN; TIN ALLOYS; TITANIUM ALLOYS;

COPPER ALLOYS;

EID: 62249177808     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-008-9290-9     Document Type: Article

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