Bonding of CVD diamond thick films using an Ag-Cu-Ti brazing alloy

Journal of Materials Processing Technology

Volumn 115, Issue 3, 2001, Pages 333-337

  Sun, Fenglian ^a   Feng, Jicai ^b   Li, Dan ^b  

^a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Ag Cu Ti alloy; Bonding; Diamond thick film

Indexed keywords

BONDING; BRAZING; CHEMICAL VAPOR DEPOSITION; ENERGY DISPERSIVE SPECTROSCOPY; FILLERS; FRACTURE; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; SURFACES; THICK FILMS; X RAY DIFFRACTION ANALYSIS;

ACTIVE METAL BRAZING; BRAZING ALLOYS;

DIAMOND FILMS;

EID: 0035944123     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(01)01005-6     Document Type: Article

References (9)