Using teardown analysis as a vehicle to teach electronic systems manufacturing cost modelling

International Journal of Engineering Education

Volumn 25, Issue 1, 2009, Pages 42-52

  Sandborn, Peter ^a   Myers, Jessica ^a   Barron, Thomas ^a   Mccarthy, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Bottom up; Cost modelling; Electronics; Product dissection; Reverse engineering; Teardowns; Top down

Indexed keywords

EID: 62149146073     PISSN: 0949149X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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