Tunable surface metal morphologies and electrical properties of monodispersed polystyrene beads coated with metal multilayers via electroless deposition

Intermetallics

Volumn 17, Issue 5, 2009, Pages 365-369

  Lee, Jun Ho ^a   Lee, Youngkwan ^a   Nam, Jae Do ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

A. Magnetic intermetallics; B. Electrical resistance and other electrical properties; C. Coatings, intermetallic and otherwise; G. Magnetic applications

Indexed keywords

BUCKLING; CONDUCTING POLYMERS; DISSOLUTION; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; GOLD DEPOSITS; INTERMETALLICS; METALS; NICKEL; NICKEL ALLOYS; NICKEL DEPOSITS; PLASTIC COATINGS; POLYMERS; POLYSTYRENES; SHELLS (STRUCTURES);

A. MAGNETIC INTERMETALLICS; B. ELECTRICAL RESISTANCE AND OTHER ELECTRICAL PROPERTIES; C. COATINGS, INTERMETALLIC AND OTHERWISE; CORE SHELLS; DISPERSION POLYMERIZATIONS; ELECTRICAL PROPERTIES; ELECTRICAL RESISTANCES; ELECTRICAL SIGNALS; ELECTRO-MECHANICAL RESPONSE; ELECTROLESS DEPOSITIONS; G. MAGNETIC APPLICATIONS; INDENTATION TESTS; LARGE DEFORMATIONS; METAL MORPHOLOGIES; METAL MULTILAYERS; METAL-POLYMER INTERFACES; METALLIC LAYERS; MONO-DISPERSED; NICKEL SURFACES; POLYSTYRENE BEADS; SEQUENTIAL ELECTROLESS DEPOSITIONS; SMOOTH SURFACES; SULFONATION PROCESS;

SURFACE MORPHOLOGY;

EID: 61749089586     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2008.11.019     Document Type: Article

References (26)

1. Hun X., and Zhang Z. Functionalized fluorescent core-shell nanoparticles used as a fluorescent labels in fluoroimmunoassay for IL-6. Biosens Bioelectron 22 (2007) 2743-2748
2. Kim K., Webster S., Levi N., Carroll D.L., Pinto M.R., and Schanze K.S. Luminescent core-shell photonic crystals from poly(phenylene etheynylene) coated silica spheres. Langmuir 21 (2005) 5207-5211
3. Burns A., Ow H., and Wiesner U. Fluorescent core-shell silica nanoparticles: towards "Lab on a particle" architectures for nanobiotechnology. Chem Soc Rev 35 (2006) 1028-1042
4. Bao J., He J., Zhang Y., Yoneyama Y., and Tsubaki N. A core/shell catalyst produces a spatially confined effect and shape selectivity in a consecutive reaction. Angew Chem Int Ed 47 (2008) 353-356
5. Lin K.-L., and Liu Y.-C. Manufacturing of Cu//electroless nickel/Sn-Pb flip chip solder bumps. IEEE T Compon Pack T 22 (1999) 575-579
6. Kim J.-Y., Kwon S., and Ihm D. Reliability and thermodynamic studies of an anisotropic conductive adhesive film (ACF) prepared from epoxy/rubber resins. J Mater Process Technol 152 (2004) 357-362
7. Date H., Hozumi Y., Tokuhira H., Usui M., Horikoshi E., and Sato T. Anisotropic conductive adhesive for fine pitch flip chip interconnections. In: Lau J. (Ed). Flip chip technology (1996), McGraw-Hill, New York 289-315
8. Shenoy D.B., Antipov A.A., Sukhorukov G.B., and MÖhwald H. Layer-by-layer engineering of biocompatible, decomposable core-shell structures. Biomacromolecules 4 (2003) 265-272
9. Huang C.-C., Yang Z., and Chang H.-T. Synthesis of dumbbell-shaped Au-Ag core-shell nanorods by seed-mediated growth under alkaline conditions. Langmuir 20 (2004) 6089-6092
10. Lee J.-H., Kim D.O., Song G.-S., Lee Y., Jung S.-B., and Nam J.-D. Direct metallization of gold nanoparticles on an polystyrene bead surface using cationic gold ligands. Macromol Rapid Commun 28 (2007) 634-640
11. Sulieman K.M., Huang X., Liu J., and Tang M. One-step growth of ZnO/ZnS core-shell nanowires by thermal evaporation. Smart Mater Struct 16 (2007) 89-92
12. Lianos P., and Thomas J.K. Small CdS particles in inverted micelles. J Colloid Interface Sci 117 (1987) 505-512
13. Wang B., Ji Z., Zimone F.T., Janowski G.M., and Rigsbee J.M. A technique for sputter coating of ceramic reinforcement particles. Surf Coat Technol 91 (1997) 64-68
14. Kaltenpoth G., Himmelhaus M., Slansky L., Caruso F., and Grunze M. Conductive core-shell particles: an approach to self-assembled mesoscopic wires. Adv Mater 15 (2003) 1113-1118
15. Yang G.H., Kang E.T., and Neoh K.G. Surface graft copolymerization of poly(tetrafluoroethylene) films with N-containing vinyl monomers for the electroless plating of copper. Langmuir 17 (2001) 211-218
16. Meek R.L. A Rutherford scattering study of catalyst systems for electroless Cu plating. J Electrochem Soc 122 (1975) 1478-1481
17. +2/poly(acrylic acid) thin films as catalysts for electroless copper deposition: mechanism of catalyst formation. J Electrochem Soc 137 (1990) 95-101
18. Gibson H.W., and Baily F.C. Chemical modification of polymers. 13. Sulfonation of polystyrene surfaces. Macromolecules 13 (1980) 34-41
19. Friedrich J., Kühn G., Mix R., and Unger W. Formation of plasma polymer layers with functional groups of different type and density at polymer surfaces and their interaction with Al atoms. Plasma Process Polym 1 (2004) 28-50
20. Ohnishi Y., Yoshimoto S., and Kato M. Metal pattern formation of by selective electroless metallization on polypyrrole films patterned by photochemical degradation of iron(III) chloride as oxidizing agent. Synth Met 144 (2004) 265-269
21. Ooka H., Inoue T., Itsuno S., and Tanaka M. Highly active and selective palladium catalyst for hydroesterification of styrene and vinyl acetate promoted by polymeric sulfonic acids. Chem Commun 9 (2005) 1173-1175
22. Mayer A.B.R., Mark J.E., and Hausner S.H. Palladium nanocatalysts protected by polyacids. J Appl Polym Sci 70 (1998) 1209-1219
23. Lee J.-H., Oh J.S., Lee P.C., Kim D.O., Lee Y., and Nam J.-D. Fabrication of nickel/gold multilayered shells on polystyrene bead cores by sequential electroless deposition processes. J Electron Mater 37 (2008) 1648-1652
24. Bhutto A.A., Vesely D., and Gabrys B.J. Miscibility and interactions in polystyrene and sodium sulfonated polystyrene with poly(vinyl methyl ether) PVME blends. Part II. FTIR. Polymer 44 (2003) 6627-6631
25. Mark J.E. Polymer data handbook (1999), Oxford University Press, Oxford pp. 56-89
26. W. Reidel. Electroless nickel plating. England: Finishing Publications Ltd. ; 1991. p. 190-251.