Optimizing process parameters of hot-bar soldering process through quality function deployment and Taguchi method

Journal of Materials Processing Technology

Volumn 209, Issue 6, 2009, Pages 2967-2977

  Jeang, Angus ^a   Chung, Chien Ping ^a   Chen, Chung Wei ^a   Li, Huan Chung ^b  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b CHIN MIN INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Hot bar soldering process; Optimizing; QFD; Taguchi method

Indexed keywords

BRAZING; LIGHT SOURCES; LIQUID CRYSTAL DISPLAYS; LIQUID CRYSTALS; MAGNETIC SUSCEPTIBILITY; OPTIMIZATION; PRINTED CIRCUIT MANUFACTURE; QUALITY CONTROL; QUALITY FUNCTION DEPLOYMENT; TAGUCHI METHODS; THIN FILM TRANSISTORS; WELDING;

CRITICAL FACTORS; ELECTRONIC MANUFACTURING SERVICES; FLEXIBLE PRINTED CIRCUITS; HOT-BAR SOLDERING PROCESS; OPTIMIZING; PROBLEM ANALYSIS; PROCESS PARAMETERS; QFD; QUALITY CHARACTERISTICS; QUALITY VALUES; SOLDER JOINTS; TFT LCDS; THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAYS; VERTICAL SIGNALS;

PRINTED CIRCUIT BOARDS;

EID: 61349084840     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.07.007     Document Type: Article

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