Microstructure and creep behavior of a Si3N4-SiC micronanocomposite

Journal of the American Ceramic Society

Volumn 92, Issue 2, 2009, Pages 439-444

  Kǎiarová, Monika ^a   Shollock, Barbara ^b   Boccaccini, Aldo ^b   Dusza, Jan ^a  

^a INSTITUTE OF MATERIALS RESEARCH   (Slovakia)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CREEP; GRAIN BOUNDARIES; GRAIN BOUNDARY SLIDING; GRAIN SIZE AND SHAPE; PHASE INTERFACES; PRECIPITATION (CHEMICAL); SILICON; SILICON CARBIDE; TEXTURES;

APPARENT ACTIVATION ENERGIES; CREEP BEHAVIORS; CREEP MECHANISMS; CREEP PARAMETERS; CREEP TESTS; GLASSY INTERGRANULAR PHASE; INTERFACE REACTIONS; INTERGRANULAR PHASIS; MICROSTRUCTURE CHANGES; NO PHASE; PARTIAL CRYSTALLIZATIONS; SIC PARTICLES; SOLUTION PRECIPITATIONS; TEM OBSERVATIONS; TEMPERATURE RANGES;

MICROCRYSTALLINE SILICON;

EID: 60849100494     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2008.02848.x     Document Type: Article

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