Scheduling a multi-chip package assembly line with reentrant processes and unrelated parallel machines

Proceedings - Winter Simulation Conference

Volumn , Issue , 2008, Pages 2286-2291

  Lee, Sang Jin ^a   Lee, Tae Eog ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY LINES; ASSEMBLY PROCESS; KEY PROCESS; MULTI-CHIP PACKAGES; ON-TIME DELIVERY PERFORMANCE; PARALLEL MACHINES; SCHEDULING PROBLEMS; SCHEDULING STRATEGIES; SET-UP TIME; UNRELATED PARALLEL MACHINES; WIRE BONDINGS;

ASSEMBLY; IMAGE STORAGE TUBES; SCHEDULING;

ELECTRONICS PACKAGING;

EID: 60749097710     PISSN: 08917736     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/WSC.2008.4736332     Document Type: Conference Paper

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