Thermal-aware electrical analysis of high-speed interconnect

2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Volumn , Issue , 2008, Pages 171-174

  Liu, En Xiao ^a   Li, Er Ping ^a,b   Wei, Xingehang ^a  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL ANALYSIS; ELECTRICAL PERFORMANCE; EQUIVALENT THERMALS; FINITE-DIFFERENCE METHODS; HIGH-SPEED-INTERCONNECT; NUMERICAL EXAMPLES; ON-CHIP INTERCONNECT; SIGNAL-INTEGRITY ANALYSIS; SPICE SIMULATORS; SUBSTRATE TEMPERATURES; TEMPERATURE PROFILES; THERMAL MODELING;

CHIP SCALE PACKAGES; OPTICAL INTERCONNECTS; PACKAGING; SIGNAL PROCESSING; SPICE; SUBSTRATES; TEMPERATURE CONTROL; THERMOANALYSIS;

ELECTRIC NETWORK ANALYSIS;

EID: 60649086030     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EDAPS.2008.4736027     Document Type: Conference Paper

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