Copper UPD as non-specific adsorption barrier in electrochemical displacement immunosensors

Biosensors and Bioelectronics

Volumn 24, Issue 7, 2009, Pages 2205-2210

  Duarte, M V ^a   Lozano Sanchez, P ^a   Katakis, I ^a  

^a Escola Tecnica Superior d'Enginyeria Quimica   (Spain)

Author keywords

2,4,6 Trichloroanisole (TCA); Copper electrodeposition; Electrochemical displacement immunosensors; Non specific adsorption; Underpotential deposition

Indexed keywords

2,4,6-TRICHLOROANISOLE (TCA); COPPER ELECTRODEPOSITION; ELECTROCHEMICAL DISPLACEMENT IMMUNOSENSORS; NON-SPECIFIC ADSORPTION; UNDERPOTENTIAL DEPOSITION;

ADSORPTION; ANTIBODIES; CHEMICAL SENSORS; COPPER; ELECTRODEPOSITION; ELECTRODES; MONOCLONAL ANTIBODIES; PLANNING; SELF ASSEMBLED MONOLAYERS; STRATEGIC PLANNING; SURFACE STRUCTURE;

IMMUNOSENSORS;

2,4,6 TRICHLOROANISOLE; ANISOLE DERIVATIVE; COPPER; GOLD; MONOCLONAL ANTIBODY; SELF ASSEMBLED MONOLAYER; UNCLASSIFIED DRUG;

ADSORPTION; ARTICLE; BINDING KINETICS; CONTROLLED STUDY; CYCLIC POTENTIOMETRY; ELECTROCHEMICAL DETECTION; IMMUNOSENSOR;

ADSORPTION; ANISOLES; BIOSENSING TECHNIQUES; COPPER; ELECTROCHEMISTRY; ELECTRODES; ELECTROPLATING; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; IMMUNOASSAY; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY;

EID: 60349091375     PISSN: 09565663     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.bios.2008.11.032     Document Type: Article

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