Multiscale modeling of metal-metal contact dynamics under high electromagnetic stress: Timescales and mechanisms for Joule melting of Al-Cu asperities

IEEE Transactions on Magnetics

Volumn 45, Issue 1, 2009, Pages 331-335

  Irving, Douglas L ^a   Padgett, Clifford W ^b   Guo, Yin ^c   Mintmire, John W ^c   Brenner, Donald W ^a  

^a North Carolina State University   (United States)

^b Armstrong State University   (United States)

^c OKLAHOMA STATE UNIVERSITY   (United States)

Author keywords

Asperity; Joule heating; Molecular dynamics simulations; Multiscale modeling

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; ELECTROMAGNETIC LAUNCHERS; JOULE HEATING; MOLECULAR DYNAMICS; SOLS;

ANALYTIC EXPRESSIONS; ASPERITY; ASPERITY CONTACTS; ATOMISTIC SIMULATIONS; ELECTROMAGNETIC STRESS; METAL-METAL CONTACTS; MOLECULAR DYNAMICS SIMULATIONS; MULTI-SCALE MODELING;

ALUMINUM ALLOYS;

EID: 59849121908     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMAG.2008.2008544     Document Type: Article

References (13)

1. K. T. Hsieh and S. Satapathy, "Plasticity model in EMAP3D," IEEE Trans. Magn., vol. 39, no. 1, pp. 142-147, Jan. 2003.
2. D. A. Hopkins, F. Stefani, K. T. Hsieh, and B. K. Kim, "Analysis of startup behavior in a "C-shaped" armature using linked EMAP3D/DYNA3D finite element codes," IEEE Trans. Magn., vol. 35, no. 1, pp. 59-64, Jan. 1999.
3. J. F. Newill, J. D. Powell, and A. E. Zielinski, "Coupled finite-element codes for armature design," IEEE Trans. Magn., vol. 39, no. 1, pp. 148-152, Jan. 2003.
4. R. M. Gee and C. Persad, "The response of different copper alloys as rail contacts at the breech of an electromagnetic launcher," IEEE Trans. Magn., vol. 37, no. 1, pp. 263-268, Jan. 2001.
5. Z. Castro and C. Persad, "Results of copper-silver rail materials tests," IEEE Trans. Magn., vol. 43, no. 1, pp. 116-119, Jan. 2007.
6. K. P. Cooper, H. N. Jones, and R. A. Meger, "Analysis of railgun barrel material," IEEE Trans. Magn., vol. 43, no. 1, pp. 120-125, Jan. 2007.
7. K. Kadau, T. C. Germann, and P. S. Lomdahl, "Molecular dynamics comes of age: 320 billion atom simulation on BlueGene/L." Int. J. Mod. Phys. C, vol. 17, no. 12, pp. 1755-1761, Dec. 2006.
8. B. J. Lee, J. H. Shim, and M. I. Baskes, "Semiempirical atomic potentials for the fcc metals Cu, Ag, Au, Ni, Pd, Pt, Al, and Pb based on first and second nearest-neighbor modified embedded atom method," Phys. Rev. B, vol. 68, no. 14, pp. 144 112/1-144 112/11, Oct. 2003.
9. S. Alavi, J. W. Mintmire, and D. L. Thompson, "Molecular dynamics simulations of the oxidation of aluminum nanoparticles," J. Phys. Chem., vol. 109, no. 1, pp. 209-214, Jan. 2005.
10. J. D. Schall, C. W. Padgett, and D. W. Brenner, "Ad hoc continuumatomistic thermostat for modeling heat flow in molecular dynamics simulations," Mot Simul., vol. 31, no. 4, pp. 283-288, Apr. 2005.
11. C. W. Padgett and D. W. Brenner, "A continuum-atomistic method for incorporating Joule heating into classical molecular dynamics simulations," Mol. Simul., vol. 31, no. 11, pp. 749-757, Sep. 2005.
12. P. G. Slade, Electrical Contact Principles and Applications. New York: Marcel Dekker, 1999.
13. S. Y. Hu, M. J. Baskes, M. Stan, and L. Q. Chen, "Atomistic calculations of interfacialenergies, nucleus shape and size of θ" precipitates in Al-Cu alloys," Acta Mater., vol. 54, no. 18, pp. 4699-4707, Oct. 2006.