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Volumn 39, Issue 1 I, 2003, Pages 142-147

Plasticity model in EMAP3D

Author keywords

Finite element; Isotropic hardening; Objective stress rate; Plasticity

Indexed keywords

ALGORITHMS; COUPLINGS; ELASTICITY; ELECTRIC POWER SUPPLIES TO APPARATUS; HARDENING; PLASTIC DEFORMATION; PLASTICITY; RAIL GUNS; STRESS ANALYSIS; STRUCTURAL ANALYSIS; THERMAL LOAD;

EID: 0037230487     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (10)

References (3)
  • 1
    • 0029208536 scopus 로고
    • A Lagrangian formulation for mechanically, thermally coupled electromagnetic diffusive processes with moving conductors
    • Jan.
    • K. T. Hsieh, "A Lagrangian formulation for mechanically, thermally coupled electromagnetic diffusive processes with moving conductors," IEEE Trans. Magn., vol. 31, pp. 604-609, Jan. 1995.
    • (1995) IEEE Trans. Magn. , vol.31 , pp. 604-609
    • Hsieh, K.T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.