Microstructure and electrical resistivity of low-temperature-cured silver films prepared using silver oxide and silver stearate pastes

Japanese Journal of Applied Physics

Volumn 48, Issue 1, 2009, Pages

  Lin, Hong Ching ^a   Lin, Pang ^a   Lu, Chun An ^a,b   Wang, Sea Fue ^a,c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DECOMPOSITION; DISSOLUTION; ELECTRIC RESISTANCE; FILM PREPARATION; FOURIER TRANSFORMS; OXIDE FILMS; OXIDES; PRINTING; RHEOLOGY; SILVER COMPOUNDS; SOLVENTS;

ALUMINA SUBSTRATES; ELECTRICAL RESISTIVITIES; HIGH DENSITIES; HIGH-SPEED MANUFACTURING; LOW RESISTIVITIES; LOW TEMPERATURES; MATRIXES; METALLO-ORGANIC DECOMPOSITIONS; PSEUDO-PLASTIC FLOWS; RHEOLOGICAL BEHAVIORS; ROLL TO ROLLS; SILVER FILMS; SILVER OXIDES; SILVER POWDERS; SOLID LOADINGS;

SILVER;

EID: 59649123182     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.48.016501     Document Type: Article

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